Inventor
CHAN DARIN A
US29 patents
⚠️ This page may combine multiple inventors who share the name “CHAN DARIN A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED MICRO DEVICES INC
26 patentsUS6441435B1Aug 27, 2002
SOI device with wrap-around contact to underside of body, and method of making
ADVANCED MICRO DEVICES INC172 citations99
US5456756AOct 10, 1995
Holding apparatus, a metal deposition system, and a wafer processing method which preserve topographical marks on a semiconductor wafer
ADVANCED MICRO DEVICES INC58 citations96
US6121663ASep 19, 2000
Local interconnects for improved alignment tolerance and size reduction
ADVANCED MICRO DEVICES INC16 citations93
US6764917B1Jul 20, 2004
SOI device with different silicon thicknesses
ADVANCED MICRO DEVICES INC23 citations92
US6114235ASep 5, 2000
Multipurpose cap layer dielectric
ADVANCED MICRO DEVICES INC32 citations92
US6022799AFeb 8, 2000
Methods for making a semiconductor device with improved hot carrier lifetime
ADVANCED MICRO DEVICES INC24 citations92
US5614446AMar 25, 1997
Holding apparatus, a metal deposition system, and a wafer processing method which preserve topographical marks on a semiconductor wafer
ADVANCED MICRO DEVICES INC30 citations92
US5597458AJan 28, 1997
Method for producing alloy films using cold sputter deposition process
ADVANCED MICRO DEVICES INC40 citations92
US6521510B1Feb 18, 2003
Method for shallow trench isolation with removal of strained island edges
ADVANCED MICRO DEVICES INC32 citations91
US6566176B1May 20, 2003
SOI device with wrap-around contact to underside of body, and method of making
ADVANCED MICRO DEVICES INC13 citations84
US7494885B1Feb 24, 2009
Disposable spacer process for field effect transistor fabrication
ADVANCED MICRO DEVICES INC8 citations82
US7015076B1Mar 21, 2006
Selectable open circuit and anti-fuse element, and fabrication method therefor
ADVANCED MICRO DEVICES INC10 citations74
US6403492B1Jun 11, 2002
Method of manufacturing semiconductor devices with trench isolation
ADVANCED MICRO DEVICES INC9 citations74
US6399480B1Jun 4, 2002
Methods and arrangements for insulating local interconnects for improved alignment tolerance and size reduction
ADVANCED MICRO DEVICES INC7 citations74
US6127261AOct 3, 2000
Method of fabricating an integrated circuit including a tri-layer pre-metal interlayer dielectric compatible with advanced CMOS technologies
ADVANCED MICRO DEVICES INC10 citations74
US5895269AApr 20, 1999
Methods for preventing deleterious punch-through during local interconnect formation
ADVANCED MICRO DEVICES INC15 citations74
US6780776B1Aug 24, 2004
Nitride offset spacer to minimize silicon recess by using poly reoxidation layer as etch stop layer
ADVANCED MICRO DEVICES INC9 citations73
US6153933ANov 28, 2000
Elimination of residual materials in a multiple-layer interconnect structure
ADVANCED MICRO DEVICES INC13 citations71
US6060404AMay 9, 2000
In-situ deposition of stop layer and dielectric layer during formation of local interconnects
ADVANCED MICRO DEVICES INC7 citations70
US7223640B2May 29, 2007
Semiconductor component and method of manufacture
ADVANCED MICRO DEVICES INC6 citations63
US6060393AMay 9, 2000
Deposition control of stop layer and dielectric layer for use in the formation of local interconnects
ADVANCED MICRO DEVICES INC4 citations63
US7023059B1Apr 4, 2006
Trenches to reduce lateral silicide growth in integrated circuit technology
ADVANCED MICRO DEVICES INC6 citations62
US7151020B1Dec 19, 2006
Conversion of transition metal to silicide through back end processing in integrated circuit technology
ADVANCED MICRO DEVICES INC2 citations61
US7250667B2Jul 31, 2007
Selectable open circuit and anti-fuse element
ADVANCED MICRO DEVICES INC0 citations52
US7465623B2Dec 16, 2008
Methods for fabricating a semiconductor device on an SOI substrate
ADVANCED MICRO DEVICES INC0 citations42
US7276755B2Oct 2, 2007
Integrated circuit and method of manufacture
ADVANCED MICRO DEVICES INC0 citations42