P

Inventor

XIE HONG

US80 patents
⚠️ This page may combine multiple inventors who share the name “XIE HONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

29 patents
US5880524AMar 9, 1999

Heat pipe lid for electronic packages

INTEL CORP309 citations99
US5990552ANov 23, 1999

Apparatus for attaching a heat sink to the back side of a flip chip package

INTEL CORP105 citations98
US5513070AApr 30, 1996

Dissipation of heat through keyboard using a heat pipe

INTEL CORP161 citations98
US5621613AApr 15, 1997

Apparatus for dissipating heat in a hinged computing device

INTEL CORP118 citations97
US5699227ADec 16, 1997

Heat pipe to baseplate attachment method

INTEL CORP42 citations95
US6166908ADec 26, 2000

Integrated circuit cartridge

INTEL CORP84 citations94
US5883782AMar 16, 1999

Apparatus for attaching a heat sink to a PCB mounted semiconductor package

INTEL CORP201 citations94
US6821823B2Nov 23, 2004

Molded substrate stiffener with embedded capacitors

INTEL CORP15 citations93
US6563703B2May 13, 2003

Portable and plugable thermal and power solution for a notebook or handheld device

INTEL CORP47 citations93
US6558169B2May 6, 2003

Shunt power connection for an integrated circuit package

INTEL CORP24 citations93
US7045890B2May 16, 2006

Heat spreader and stiffener having a stiffener extension

INTEL CORP35 citations92
US6493223B1Dec 10, 2002

Computer utilizing refrigeration for cooling

INTEL CORP27 citations92
US5949647ASep 7, 1999

Heat pipe to baseplate attachment method

INTEL CORP37 citations92
US7133294B2Nov 7, 2006

Integrated circuit packages with sandwiched capacitors

INTEL CORP16 citations91
US6900991B2May 31, 2005

Electronic assembly with sandwiched capacitors and methods of manufacture

INTEL CORP20 citations91
US6575766B1Jun 10, 2003

Laminated socket contacts

INTEL CORP20 citations91
US6256199B1Jul 3, 2001

Integrated circuit cartridge and method of fabricating the same

INTEL CORP24 citations89
US7578678B2Aug 25, 2009

Protected socket for integrated circuit devices

INTEL CORP8 citations84
US7332423B2Feb 19, 2008

Soldering a die to a substrate

INTEL CORP14 citations81
US6710444B2Mar 23, 2004

Molded substrate stiffener with embedded capacitors

INTEL CORP11 citations74
US7510418B1Mar 31, 2009

Loading mechanisms for integrated circuit (IC) packages

INTEL CORP7 citations73
US7316573B2Jan 8, 2008

Protected socket for integrated circuit devices

INTEL CORP6 citations73
US6011696AJan 4, 2000

Cartridge and an enclosure for a semiconductor package

INTEL CORP13 citations73
US6853061B2Feb 8, 2005

Dual power supply method and apparatus

INTEL CORP10 citations72
US5956229ASep 21, 1999

Injection molded thermal interface system

INTEL CORP8 citations72
US6992378B2Jan 31, 2006

Socket and package power/ground bar apparatus that increases current carrying capacity resulting in higher IC power delivery

INTEL CORP2 citations62
US6979208B2Dec 27, 2005

Laminated socket contacts

INTEL CORP3 citations61
US6854979B2Feb 15, 2005

Laminated socket contacts

INTEL CORP3 citations61
US6672880B2Jan 6, 2004

Laminated socket contacts

INTEL CORP2 citations61

AGENCY SCIENCE TECH & RES

6 patents

LUCENT TECHNOLOGIES INC

5 patents

ILLUMINA INC

2 patents

ALCATEL LUCENT USA INC

1 patent

HUAWEI TECH CO LTD

1 patent

MACK KARL

1 patent

SHENZHEN YUSHENGDA TECH CO LTD

1 patent

SHANGHAI INST MICROSYSTEM & INFORMATION TECH CAS

1 patent

DONGGUAN NVT TECH LIMITED

1 patent

DONGGUAN NVT TECH CO LTD

1 patent

O NET COMM SHENZHEN LTD

1 patent

Showing the top 50 of 80 patents by PatentIndex Score.