Inventor

GATES STEPHEN MCCONNELL

US43 patents

⚠️ This page may combine multiple inventors who share the name “GATES STEPHEN MCCONNELL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GATES STEPHEN MCCONNELL

IBM

Multiphase low dielectric constant material and method of deposition

Multiphase low dielectric constant material and method of deposition

Multiphase low dielectric constant material

Merged logic and memory combining thin film and bulk Si transistors

Atomic layer deposition with nitrate containing precursors

Thin film transistors fabricated on plastic substrates

Ultra low k plasma enhanced chemical vapor deposition processes using a single bifunctional precursor containing both a SiCOH matrix functionality and organic porogen functionality

Electronic structures with reduced capacitance

Hybrid low-k interconnect structure comprised of 2 spin-on dielectric materials

Merged logic and memory combining thin film and bulk Si transistors

Low-k interconnect structure comprised of a multilayer of spin-on porous dielectrics

Decoupling capacitor structure distributed above an integrated circuit and method for making same

Semiconductor device having ultra-sharp P-N junction and method of manufacturing the same

Variable index distributed mirror

Multilayer hardmask scheme for damage-free dual damascene processing of SiCOH dielectrics

Ultra low k (ULK) SiCOH film and method

Electronic structures with reduced capacitance

Ordered two-phase dielectric film, and semiconductor device containing the same

Low temperature processes for making electronic device structures

Semiconductor device having ultra-sharp P-N junction and method of manufacturing the same

Method to form a polycrystalline film on a substrate

Semiconductor devices containing a discontinuous cap layer and methods for forming same

Interconnects containing first and second porous low-k dielectrics separated by a porous buried etch stop layer

Nonoparticles formed with rigid connector compounds

Low-k interconnect structure comprised of a multilayer of spin-on porous dielectrics

Nanoparticles formed with rigid connector compounds

Diode connected to a magnetic tunnel junction and self aligned with a metallic conductor and method of forming the same

Cu/low-k BEOL with nonconcurrent hybrid dielectric interface

Nanoparticles formed with rigid connector compounds

Diffusion barrier layer and semiconductor device containing same

Method for forming a single crystal semiconductor on a substrate

Ultralow dielectric constant layer with controlled biaxial stress

Method for dual-damascence patterning of low-k interconnects using spin-on distributed hardmask

Multilayer hardmask scheme for damage-free dual damascene processing of SiCOH dielectrics

Method of forming a ceramic diffusion barrier layer

Interconnect structures incorporating low-k dielectric barrier films

Spin-on cap layer, and semiconductor device containing same

Interconnect structure with precise conductor resistance and method to form same

Semiconductor recessed mask interconnect technology

Laminated diffusion barrier

Diffusion barrier with low dielectric constant and semiconductor device containing same

(unassigned)

Diode connected to a magnetic tunnel junction and self aligned with a metallic conductor and method for forming the same

NGUYEN SON VAN

Ultra low κ plasma enhanced chemical vapor deposition processes using a single bifunctional precursor containing both a SiCOH matrix functionality and organic porogen functionality