Inventor · disambiguated record
Jeffrey Hedrick
Also filed as: HEDRICK JEFFREY · HEDRICK JEFFREY C · HEDRICK JEFFREY CURTIS
70 granted patents·8 pending applications·2,949 citations·filing 1992–2017
99Inventor score
Top patents by PatentIndex Score
78 records- 0199US6413852B1Method of forming multilevel interconnect structure containing air gaps including utilizing both sacrificial and placeholder materialIBM·Filed 2000·Granted Jul 2, 2002·264 cites·25 claims
- 0298US5898991AMethods of fabrication of coaxial vias and magnetic devicesIBM·Filed 1997·Granted May 4, 1999·219 cites·21 claims
- 0398US5700844AProcess for making a foamed polymerIBM·Filed 1996·Granted Dec 23, 1997·186 cites·4 claims
- 0497US6451712B1Method for forming a porous dielectric material layer in a semiconductor device and device formedIBM·Filed 2000·Granted Sep 17, 2002·123 cites·43 claims
- 0597US5804607AProcess for making a foamed elastomeric polymerIBM·Filed 1997·Granted Sep 8, 1998·144 cites·8 claims
- 0697US5726211AProcess for making a foamed elastometric polymerIBM·Filed 1996·Granted Mar 10, 1998·151 cites·8 claims
- 0797US5541567ACoaxial vias in an electronic substrateIBM·Filed 1994·Granted Jul 30, 1996·163 cites·38 claims
- 0896US6911400B2Nonlithographic method to produce self-aligned mask, articles produced by same and compositions for sameIBM·Filed 2002·Granted Jun 28, 2005·79 cites·49 claims
- 0996US6323436B1High density printed wiring board possessing controlled coefficient of thermal expansion with thin film redistribution layerIBM·Filed 1997·Granted Nov 27, 2001·156 cites·12 claims
- 1095US6815329B2Multilayer interconnect structure containing air gaps and method for makingIBM·Filed 2002·Granted Nov 9, 2004·105 cites·13 claims
- 1194US6093636AProcess for manufacture of integrated circuit device using a matrix comprising porous high temperature thermosetsIBM·Filed 1998·Granted Jul 25, 2000·158 cites·20 claims
- 1294US5536921ASystem for applying microware energy in processing sheet like materialsIBM·Filed 1995·Granted Jul 16, 1996·140 cites·19 claims
- 1393US6737725B2Multilevel interconnect structure containing air gaps and method for makingIBM·Filed 2002·Granted May 18, 2004·70 cites·12 claims
- 1492US6641899B1Nonlithographic method to produce masks by selective reaction, articles produced, and composition for sameIBM·Filed 2002·Granted Nov 4, 2003·43 cites·11 claims
- 1591US6603204B2Low-k interconnect structure comprised of a multilayer of spin-on porous dielectricsIBM·Filed 2001·Granted Aug 5, 2003·54 cites·29 claims
- 1691US6455443B1Method of fabricating low-dielectric constant interlevel dielectric films for BEOL interconnects with enhanced adhesion and low-defect densityIBM·Filed 2001·Granted Sep 24, 2002·60 cites·22 claims
- 1790US6677680B2Hybrid low-k interconnect structure comprised of 2 spin-on dielectric materialsIBM·Filed 2001·Granted Jan 13, 2004·54 cites·25 claims
- 1889US7695776B2Transparent hard coats for optical elementsIBM·Filed 2008·Granted Apr 13, 2010·8 cites·5 claims
- 1988US7098476B2Multilayer interconnect structure containing air gaps and method for makingIBM·Filed 2004·Granted Aug 29, 2006·39 cites·4 claims
- 2086US6486557B1Hybrid dielectric structure for improving the stiffness of back end of the line structuresIBM·Filed 2000·Granted Nov 26, 2002·48 cites·11 claims
- 2185US5599611APrepreg and cured laminate fabricated from a toughened polycyanurateIBM·Filed 1994·Granted Feb 4, 1997·30 cites·24 claims
- 2285US5527838AToughened polycyanurate resins containing particulatesIBM·Filed 1994·Granted Jun 18, 1996·30 cites·56 claims
- 2384US5527592AMultilayer article having a planarized outer layer comprising a toughened polycyanurateIBM·Filed 1994·Granted Jun 18, 1996·28 cites·5 claims
- 2483US6242139B1Color filter for TFT displaysIBM·Filed 1998·Granted Jun 5, 2001·67 cites·1 claims
- 2582US5591285AFluorinated carbon polymer compositesIBM·Filed 1995·Granted Jan 7, 1997·38 cites·12 claims
- 2681US7470597B2Method of fabricating a multilayered dielectric diffusion barrier layerIBM·Filed 2006·Granted Dec 30, 2008·5 cites·1 claims
- 2781US7084479B2Line level air gapsIBM·Filed 2003·Granted Aug 1, 2006·27 cites·15 claims
- 2881US5397863AFluorinated carbon polymer compositesIBM·Filed 1992·Granted Mar 14, 1995·35 cites·17 claims
- 2980US7948051B2Nonlithographic method to produce self-aligned mask, articles produced by same and compositions for sameIBM·Filed 2008·Granted May 24, 2011·4 cites·15 claims
- 3080US6716742B2Low-k interconnect structure comprised of a multilayer of spin-on porous dielectricsIBM·Filed 2002·Granted Apr 6, 2004·24 cites·57 claims
- 3178USRE45781EToughness, adhesion and smooth metal lines of porous low K dielectric interconnect structuresHEDRICK JEFFREY C·Filed 2014·Granted Oct 27, 2015·4 cites·65 claims
- 3278US8491987B2Selectively coated self-aligned maskCOLBURN MATTHEW E·Filed 2008·Granted Jul 23, 2013·4 cites·6 claims
- 3378US5827907AHomo-, co- or multicomponent thermoplastic polymer dispersed in a thermoset resinIBM·Filed 1993·Granted Oct 27, 1998·19 cites·34 claims
- 3477US6831366B2Interconnects containing first and second porous low-k dielectrics separated by a porous buried etch stop layerIBM·Filed 2003·Granted Dec 14, 2004·19 cites·40 claims
- 3576US7081673B2Multilayered cap barrier in microelectronic interconnect structuresIBM·Filed 2003·Granted Jul 25, 2006·12 cites·22 claims
- 3676US6783862B2Toughness, adhesion and smooth metal lines of porous low k dielectric interconnect structuresIBM·Filed 2002·Granted Aug 31, 2004·12 cites·51 claims
- 3776US5556899AFluorinated carbon polymer compositesIBM·Filed 1994·Granted Sep 17, 1996·28 cites·8 claims
- 3874US6933586B2Porous low-k dielectric interconnects with improved adhesion produced by partial burnout of surface porogensIBM·Filed 2002·Granted Aug 23, 2005·11 cites·25 claims
- 3973US6537908B2Method for dual-damascence patterning of low-k interconnects using spin-on distributed hardmaskIBM·Filed 2001·Granted Mar 25, 2003·16 cites·27 claims
- 4072US7951705B2Multilayered cap barrier in microelectronic interconnect structuresIBM·Filed 2008·Granted May 31, 2011·2 cites·19 claims
- 4172US7256146B2Method of forming a ceramic diffusion barrier layerIBM·Filed 2005·Granted Aug 14, 2007·5 cites·8 claims
- 4271US5863332AFluid jet impregnating and coating device with thickness control capabilityIBM·Filed 1996·Granted Jan 26, 1999·26 cites·3 claims
- 4369US6803660B1Patterning layers comprised of spin-on ceramic filmsIBM·Filed 2003·Granted Oct 12, 2004·19 cites·9 claims
- 4469US5725668AExpandable fluid treatment device for tublar surface treatmentsIBM·Filed 1996·Granted Mar 10, 1998·22 cites·19 claims
- 4568US5571852AFluorinated carbon polymer compositesIBM·Filed 1995·Granted Nov 5, 1996·20 cites·14 claims
- 4667US6710450B2Interconnect structure with precise conductor resistance and method to form sameIBM·Filed 2001·Granted Mar 23, 2004·11 cites·18 claims
- 4767US6638878B2Film planarization for low-k polymers used in semiconductor structuresIBM·Filed 2001·Granted Oct 28, 2003·10 cites·18 claims
- 4866US7378146B1Transparent hard coats for optical elementsIBM·Filed 1998·Granted May 27, 2008·25 cites·11 claims
- 4965US5824157AFluid jet impregnationIBM·Filed 1995·Granted Oct 20, 1998·21 cites·18 claims
- 5064US6724069B2Spin-on cap layer, and semiconductor device containing sameIBM·Filed 2001·Granted Apr 20, 2004·12 cites·22 claims
Showing the top 50 of 78 patent records by PatentIndex Score.
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