Inventor
LEE KIAN CHAI
SG14 patents
⚠️ This page may combine multiple inventors who share the name “LEE KIAN CHAI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
13 patentsUS6583502B2Jun 24, 2003
Apparatus for package reduction in stacked chip and board assemblies
MICRON TECHNOLOGY INC110 citations99
US6787917B2Sep 7, 2004
Apparatus for package reduction in stacked chip and board assemblies
MICRON TECHNOLOGY INC45 citations96
US6720666B2Apr 13, 2004
BOC BGA package for die with I-shaped bond pad layout
MICRON TECHNOLOGY INC91 citations95
US6692987B2Feb 17, 2004
BOC BGA package for die with I-shaped bond pad layout
MICRON TECHNOLOGY INC60 citations94
US7915718B2Mar 29, 2011
Apparatus for flip-chip packaging providing testing capability
MICRON TECHNOLOGY INC29 citations92
US7005316B2Feb 28, 2006
Method for package reduction in stacked chip and board assemblies
MICRON TECHNOLOGY INC23 citations92
US6787923B2Sep 7, 2004
Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks
MICRON TECHNOLOGY INC32 citations89
US6656769B2Dec 2, 2003
Method and apparatus for distributing mold material in a mold for packaging microelectronic devices
MICRON TECHNOLOGY INC26 citations84
US7320933B2Jan 22, 2008
Double bumping of flexible substrate for first and second level interconnects
MICRON TECHNOLOGY INC15 citations83
US7061124B2Jun 13, 2006
Solder masks including dams for at least partially surrounding terminals of a carrier substrate and recessed areas positioned adjacent to the dams, and carrier substrates including such solder masks
MICRON TECHNOLOGY INC10 citations72
US7018871B2Mar 28, 2006
Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks, and methods
MICRON TECHNOLOGY INC10 citations72
US7368391B2May 6, 2008
Methods for designing carrier substrates with raised terminals
MICRON TECHNOLOGY INC8 citations70
US7112048B2Sep 26, 2006
BOC BGA package for die with I-shaped bond pad layout
MICRON TECHNOLOGY INC4 citations60