Inventor
TAN YONG KIAN
SG9 patents
Patents
9 patentsUS6720666B2Apr 13, 2004
BOC BGA package for die with I-shaped bond pad layout
MICRON TECHNOLOGY INC91 citations95
US6692987B2Feb 17, 2004
BOC BGA package for die with I-shaped bond pad layout
MICRON TECHNOLOGY INC60 citations94
US7071012B2Jul 4, 2006
Methods relating to the reconstruction of semiconductor wafers for wafer-level processing
MICRON TECHNOLOGY INC17 citations92
US7190074B2Mar 13, 2007
Reconstructed semiconductor wafers including alignment droplets contacting alignment vias
MICRON TECHNOLOGY INC5 citations73
US6856155B2Feb 15, 2005
Methods and apparatus for testing and burn-in of semiconductor devices
MICRON TECHNOLOGY INC9 citations71
US7820459B2Oct 26, 2010
Methods relating to the reconstruction of semiconductor wafers for wafer level processing including forming of alignment protrusion and removal of alignment material
MICRON TECHNOLOGY INC1 citations62
US7425462B2Sep 16, 2008
Methods relating to the reconstruction of semiconductor wafers for wafer-level processing
MICRON TECHNOLOGY INC2 citations62
US7112048B2Sep 26, 2006
BOC BGA package for die with I-shaped bond pad layout
MICRON TECHNOLOGY INC4 citations60
US7573006B2Aug 11, 2009
Apparatus relating to the reconstruction of semiconductor wafers for wafer-level processing
MICRON TECHNOLOGY INC0 citations51