Inventor
KHOO SIAN YONG
SG5 patents
⚠️ This page may combine multiple inventors who share the name “KHOO SIAN YONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
4 patentsUS6720666B2Apr 13, 2004
BOC BGA package for die with I-shaped bond pad layout
MICRON TECHNOLOGY INC91 citations95
US6692987B2Feb 17, 2004
BOC BGA package for die with I-shaped bond pad layout
MICRON TECHNOLOGY INC60 citations94
US7320933B2Jan 22, 2008
Double bumping of flexible substrate for first and second level interconnects
MICRON TECHNOLOGY INC15 citations83
US7112048B2Sep 26, 2006
BOC BGA package for die with I-shaped bond pad layout
MICRON TECHNOLOGY INC4 citations60