Inventor
TANG YOKE KUIN
SG3 patents
Patents
3 patentsUS6720666B2Apr 13, 2004
BOC BGA package for die with I-shaped bond pad layout
MICRON TECHNOLOGY INC91 citations95
US6692987B2Feb 17, 2004
BOC BGA package for die with I-shaped bond pad layout
MICRON TECHNOLOGY INC60 citations94
US7112048B2Sep 26, 2006
BOC BGA package for die with I-shaped bond pad layout
MICRON TECHNOLOGY INC4 citations60