Inventor

CHIANG STEVE S

US41 patents

⚠️ This page may combine multiple inventors who share the name “CHIANG STEVE S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHIANG STEVE S

ACTEL CORP

Antifuse structure suitable for VLSI application

Antifuse structure suitable for VLSI application

Electrically-programmable low-impedance anti-fuse element

Apparatus for improving antifuse programming yield and reducing antifuse programming time

Structure for protecting thin dielectrics during processing

Electrically-programmable low-impedance anti-fuse element

Read-disturb tolerant metal-to-metal antifuse and fabrication method

Methods of reducing anti-fuse resistance during programming

Circuits for ESD protection of metal-to-metal antifuses during processing

Misalignment tolerant antifuse

Methods for programming antifuses having at least one metal electrode

Metal-to-metal antifuse including etch stop layer

Antifuse structure suitable for VLSI application

Method of fabricating an antifuse

Circuits for ESD protection of metal-to-metal antifuses during processing

Structure for protecting thin dielectrics during processing

Circuits for ESD Protection of metal to-metal antifuses during processing

PROLINX LABS CORP

Ball grid array structure and method for packaging an integrated circuit chip

Method and structure to interconnect traces of two conductive layers in a printed circuit board

Multilayer board having insulating isolation rings

Antifuse interconnect between two conducting layers of a printed circuit board

Programmable/reprogrammable printed circuit board using fuse and/or antifuse as interconnect

Programmable/reprogramable structure using fuses and antifuses

Apparatus including a programmable socket adapter for coupling an electronic component to a component socket on a printed circuit board

Method and structure for programming fuses

Method for supporting one or more electronic components

Use of conductive particles in a nonconductive body as an integrated circuit antifuse

Ball grid array structure and method for packaging an integrated circuit chip

Programmable cable and cable adapter using fuses and antifuses

Device-under-test card for a burn-in board

Programmable/reprogrammable structure using fuses and antifuses

TEXAS INSTRUMENTS INC

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

REFLECTIVITY INC

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

(unassigned)

Metal-to-metal antifuse including etch stop layer