Inventor
HONDA KATSUO
JP13 patents
Patents
13 patentsUS5816895AOct 6, 1998
Surface grinding method and apparatus
TOKYO SEIMITSU CO LTD78 citations95
US5791976AAug 11, 1998
Surface machining method and apparatus
TOKYO SEIMITSU CO LTD22 citations92
US4852304AAug 1, 1989
Apparatus and method for slicing a wafer
TOKYO SEIMITSU CO LTD24 citations90
US5295331AMar 22, 1994
Method of chamfering semiconductor wafer
TOKYO SEIMITSU CO LTD41 citations88
US6042459AMar 28, 2000
Surface machining method and apparatus
TOKYO SEIMITSU CO LTD15 citations81
US6752701B1Jun 22, 2004
Planarization apparatus with grinding and etching devices and holding device for moving workpiece between said devices
TOKYO SEIMITSU CO LTD7 citations73
US6030278AFeb 29, 2000
Surface machining method and apparatus
TOKYO SEIMITSU CO LTD6 citations73
US4903681AFeb 27, 1990
Method and apparatus for cutting a cylindrical material
TOKYO SEIMITSU CO LTD12 citations73
US4894956AJan 23, 1990
Apparatus and method for slicing a wafer
TOKYO SEIMITSU CO LTD9 citations71
US6913526B2Jul 5, 2005
Polishing machine for polishing periphery of sheet
TOKYO SEIMITSU CO LTD5 citations62
US5524604AJun 11, 1996
Method and apparatus for slicing semiconductor wafers
TOKYO SEIMITSU CO LTD2 citations62
US5000156AMar 19, 1991
Method and device for dressing an inner peripheral blade in a slicing machine
TOKYO SEIMITSU CO LTD5 citations54
US4838238AJun 13, 1989
Internal peripheral edge type blade holding device
TOKYO SEIMITSU CO LTD1 citations44