Inventor
LO HENRY
TW29 patents
⚠️ This page may combine multiple inventors who share the name “LO HENRY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
19 patentsUS7974728B2Jul 5, 2011
System for extraction of key process parameters from fault detection classification to enable wafer prediction
TAIWAN SEMICONDUCTOR MFG51 citations97
US6872127B2Mar 29, 2005
Polishing pad conditioning disks for chemical mechanical polisher
TAIWAN SEMICONDUCTOR MFG29 citations92
US7634325B2Dec 15, 2009
Prediction of uniformity of a wafer
TAIWAN SEMICONDUCTOR MFG12 citations83
US7332449B2Feb 19, 2008
Method for forming dual damascenes with supercritical fluid treatments
TAIWAN SEMICONDUCTOR MFG10 citations83
US7928549B2Apr 19, 2011
Integrated circuit devices with multi-dimensional pad structures
TAIWAN SEMICONDUCTOR MFG9 citations79
US7083495B2Aug 1, 2006
Advanced process control approach for Cu interconnect wiring sheet resistance control
TAIWAN SEMICONDUCTOR MFG9 citations74
US6987064B2Jan 17, 2006
Method and composition to improve a nitride/oxide wet etching selectivity
TAIWAN SEMICONDUCTOR MFG8 citations68
US7767471B2Aug 3, 2010
Auto routing for optimal uniformity control
TAIWAN SEMICONDUCTOR MFG3 citations62
US7544606B2Jun 9, 2009
Method to implement stress free polishing
TAIWAN SEMICONDUCTOR MFG2 citations62
US7387973B2Jun 17, 2008
Method for improving low-K dielectrics by supercritical fluid treatments
TAIWAN SEMICONDUCTOR MFG5 citations62
US6875285B2Apr 5, 2005
System and method for dampening high pressure impact on porous materials
TAIWAN SEMICONDUCTOR MFG5 citations62
US6746966B1Jun 8, 2004
Method to solve alignment mark blinded issues and a technology for application of semiconductor etching at a tiny area
TAIWAN SEMICONDUCTOR MFG4 citations62
US7851234B2Dec 14, 2010
System and method for enhanced control of copper trench sheet resistance uniformity
TAIWAN SEMICONDUCTOR MFG4 citations61
US7338909B2Mar 4, 2008
Micro-etching method to replicate alignment marks for semiconductor wafer photolithography
TAIWAN SEMICONDUCTOR MFG5 citations58
US7951723B2May 31, 2011
Integrated etch and supercritical CO2 process and chamber design
TAIWAN SEMICONDUCTOR MFG1 citations52
US7354623B2Apr 8, 2008
Surface modification of a porous organic material through the use of a supercritical fluid
TAIWAN SEMICONDUCTOR MFG1 citations51
US6884149B2Apr 26, 2005
Method and system for in-situ monitoring of mixing ratio of high selectivity slurry
TAIWAN SEMICONDUCTOR MFG0 citations50
US6729935B2May 4, 2004
Method and system for in-situ monitoring of mixing ratio of high selectivity slurry
TAIWAN SEMICONDUCTOR MFG0 citations50
US7129151B2Oct 31, 2006
Planarizing method employing hydrogenated silicon nitride planarizing stop layer
TAIWAN SEMICONDUCTOR MFG1 citations45
KO FRANCIS
3 patentsUS8682466B2Mar 25, 2014
Automatic virtual metrology for semiconductor wafer result prediction
KO FRANCIS13 citations81
US8409993B2Apr 2, 2013
Method and system for controlling copper chemical mechanical polish uniformity
KO FRANCIS2 citations61
US9037279B2May 19, 2015
Clustering for prediction models in process control and for optimal dispatching
KO FRANCIS1 citations51