Inventor
HARTIG CARSTEN
DE14 patents
⚠️ This page may combine multiple inventors who share the name “HARTIG CARSTEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED MICRO DEVICES INC
8 patentsUS7259091B2Aug 21, 2007
Technique for forming a passivation layer prior to depositing a barrier layer in a copper metallization layer
ADVANCED MICRO DEVICES INC268 citations98
US6724096B2Apr 20, 2004
Die corner alignment structure
ADVANCED MICRO DEVICES INC14 citations83
US7410885B2Aug 12, 2008
Method of reducing contamination by removing an interlayer dielectric from the substrate edge
ADVANCED MICRO DEVICES INC12 citations82
US6720242B2Apr 13, 2004
Method of forming a substrate contact in a field effect transistor formed over a buried insulator layer
ADVANCED MICRO DEVICES INC18 citations82
US7098140B2Aug 29, 2006
Method of compensating for etch rate non-uniformities by ion implantation
ADVANCED MICRO DEVICES INC10 citations73
US6936383B2Aug 30, 2005
Method of defining the dimensions of circuit elements by using spacer deposition techniques
ADVANCED MICRO DEVICES INC8 citations71
US6838010B2Jan 4, 2005
System and method for wafer-based controlled patterning of features with critical dimensions
ADVANCED MICRO DEVICES INC2 citations62
US7663766B2Feb 16, 2010
Incorporating film optical property measurements into scatterometry metrology
ADVANCED MICRO DEVICES INC3 citations59
GLOBALFOUNDRIES INC
5 patentsUS8892237B2Nov 18, 2014
Systems and methods for fabricating semiconductor device structures using different metrology tools
GLOBALFOUNDRIES INC5 citations72
US9091667B2Jul 28, 2015
Detection of particle contamination on wafers
GLOBALFOUNDRIES INC3 citations60
US9171765B2Oct 27, 2015
Inline residual layer detection and characterization post via post etch using CD-SEM
GLOBALFOUNDRIES INC0 citations52
US9177873B2Nov 3, 2015
Systems and methods for fabricating semiconductor device structures
GLOBALFOUNDRIES INC1 citations49
US10115621B2Oct 30, 2018
Method for in-die overlay control using FEOL dummy fill layer
GLOBALFOUNDRIES INC1 citations44