Inventor
KANDANUR SASHI S
US7 patents
Patents
7 patentsUS11127682B2Sep 21, 2021
Semiconductor package having nonspherical filler particles
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US12349282B2Jul 1, 2025
Capacitors in through glass vias
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US10798817B2Oct 6, 2020
Method for making a flexible wearable circuit
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US10856424B2Dec 1, 2020
Electronic assembly that includes void free holes
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US10327330B2Jun 18, 2019
Stretchable electronic assembly
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US12476175B2Nov 18, 2025
Glass substrates having transverse capacitors for use with semiconductor packages and related methods
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US10428439B2Oct 1, 2019
Predictive capability for electroplating shield design
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