Inventor
SONG HYEONJUN
KR4 patents
Patents
4 patentsUS11257794B2Feb 22, 2022
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations68
US11658160B2May 23, 2023
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations58
US11469099B2Oct 11, 2022
Semiconductor package with chip end design and trenches to control fillet spreading in stacked chip packages
SAMSUNG ELECTRONICS CO LTD0 citations58
US12424582B2Sep 23, 2025
Semiconductor package including a plurality of semiconductor chips
SAMSUNG ELECTRONICS CO LTD0 citations42