Inventor
OH EUNKYUL
KR6 patents
Patents
6 patentsUS11335668B2May 17, 2022
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD1 citations70
US11257794B2Feb 22, 2022
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations68
US12119329B2Oct 15, 2024
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations59
US11769755B2Sep 26, 2023
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations59
US11658160B2May 23, 2023
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations58
US12456671B2Oct 28, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations53