Inventor
MAVEETY JAMES G
US37 patents
⚠️ This page may combine multiple inventors who share the name “MAVEETY JAMES G”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
28 patentsUS6650542B1Nov 18, 2003
Piezoelectric actuated jet impingement cooling
INTEL CORP116 citations98
US6785134B2Aug 31, 2004
Embedded liquid pump and microchannel cooling system
INTEL CORP54 citations96
US6410982B1Jun 25, 2002
Heatpipesink having integrated heat pipe and heat sink
INTEL CORP124 citations94
US7886813B2Feb 15, 2011
Thermal interface material with carbon nanotubes and particles
INTEL CORP29 citations93
US7696015B2Apr 13, 2010
Method of forming a stack of heat generating integrated circuit chips with intervening cooling integrated circuit chips
INTEL CORP15 citations93
US6924170B2Aug 2, 2005
Diamond-silicon hybrid integrated heat spreader
INTEL CORP34 citations93
US6906919B2Jun 14, 2005
Two-phase pumped liquid loop for mobile computer cooling
INTEL CORP34 citations93
US7428138B2Sep 23, 2008
Forming carbon nanotube capacitors
INTEL CORP31 citations92
US6992381B2Jan 31, 2006
Using external radiators with electroosmotic pumps for cooling integrated circuits
INTEL CORP16 citations92
US5948204ASep 7, 1999
Wafer carrier ring method and apparatus for chemical-mechanical planarization
INTEL CORP45 citations85
US7911052B2Mar 22, 2011
Nanotube based vapor chamber for die level cooling
INTEL CORP11 citations84
US7492041B2Feb 17, 2009
Diamond-silicon hybrid integrated heat spreader
INTEL CORP9 citations84
US7449780B2Nov 11, 2008
Apparatus to minimize thermal impedance using copper on die backside
INTEL CORP11 citations84
US7335983B2Feb 26, 2008
Carbon nanotube micro-chimney and thermo siphon die-level cooling
INTEL CORP10 citations84
US9869714B2Jan 16, 2018
Integrated circuit test temperature control mechanism
INTEL CORP9 citations83
US7545030B2Jun 9, 2009
Article having metal impregnated within carbon nanotube array
INTEL CORP10 citations83
US8006747B2Aug 30, 2011
Micro-chimney and thermosiphon die-level cooling
INTEL CORP4 citations74
US7487822B2Feb 10, 2009
Micro-chimney and thermosiphon die-level cooling
INTEL CORP4 citations74
US7084495B2Aug 1, 2006
Electroosmotic pumps using porous frits for cooling integrated circuit stacks
INTEL CORP7 citations74
US6988531B2Jan 24, 2006
Micro-chimney and thermosiphon die-level cooling
INTEL CORP9 citations74
US9448278B2Sep 20, 2016
Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same
INTEL CORP5 citations71
US7021891B2Apr 4, 2006
Micro-impeller miniature centrifugal compressor
INTEL CORP8 citations68
US7274106B2Sep 25, 2007
Packaged electroosmotic pumps using porous frits for cooling integrated circuits
INTEL CORP2 citations63
US7964447B2Jun 21, 2011
Process of making carbon nanotube array that includes impregnating the carbon nanotube array with metal
INTEL CORP3 citations62
US7723208B2May 25, 2010
Integrated re-combiner for electroosmotic pumps using porous frits
INTEL CORP0 citations52
US7576432B2Aug 18, 2009
Using external radiators with electroosmotic pumps for cooling integrated circuits
INTEL CORP1 citations52
US6490167B1Dec 3, 2002
Semiconductor package ejector
INTEL CORP4 citations52
US6350136B1Feb 26, 2002
Method and apparatus for a pin clamp
INTEL CORP1 citations51
CHRYSLER GREGORY M
2 patentsUS8505613B2Aug 13, 2013
Die having a via filled with a heat-dissipating material
CHRYSLER GREGORY M1 citations61
US8404519B2Mar 26, 2013
Process that includes assembling together first and second substrates the have respective first and second carbon nanotube arrays with geometrically complementary patterns
CHRYSLER GREGORY M2 citations60