Inventor

MYERS ALAN M

US44 patents

⚠️ This page may combine multiple inventors who share the name “MYERS ALAN M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MYERS ALAN M

INTEL CORP

Methods of forming channels on an integrated circuit die and die cooling systems including such channels

Anchored via connection

Via hole profile and method of fabrication

Method of forming a stack of heat generating integrated circuit chips with intervening cooling integrated circuit chips

Self-aligned electrodes contained within the trenches of an electroosmotic pump

Method for making a semiconductor device that has a dual damascene interconnect

Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die package

Using external radiators with electroosmotic pumps for cooling integrated circuits

Pattern-sensitive deposition for damascene processing

Via hole profile and method of fabrication

Method and structure to contact tight pitch conductive layers with guided vias using alternating hardmasks and encapsulating etchstop liner scheme

Techniques for forming interconnects in porous dielectric materials

Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die package

Methods of forming channels on an integrated circuit die and die cooling systems including such channels

Integrated circuit coolant microchannel with compliant cover

Textile patterning for subtractively-patterned self-aligned interconnects, plugs, and vias

Electroosmotic pumps using porous frits for cooling integrated circuit stacks

Method for making a sub 100 nanometer semiconductor device using conventional lithography steps

Self-aligned via and plug patterning with photobuckets for back end of line (BEOL) interconnects

Methods for forming interconnect layers having tight pitch interconnect structures

Method for manufacturing porous silicon

Methods of forming channels on an integrated circuit die and die cooling systems including such channels

Packaged electroosmotic pumps using porous frits for cooling integrated circuits

Textile patterning for subtractively-patterned self-aligned interconnects, plugs, and vias

Orientation independent electroosmotic pump

Via self alignment and shorting improvement with airgap integration capacitance benefit

Techniques for forming interconnects in porous dielectric materials

Integrated re-combiner for electroosmotic pumps using porous frits

Using external radiators with electroosmotic pumps for cooling integrated circuits

Micropin heat exchanger

UNIV IOWA STATE RES FOUND INC

Isolation of SU1, a starch debranching enzyme, the product of the maize gene sugary1

Isolation of SU1, a starch debranching enzyme, the product of the maize gene sugary1

Isolation of SU1, a starch debranching enzyme, the product of the maize gene sugaryl

Identification and characterization of a novel alpha-amylase from maize endosperm

Dull1 coding for a starch synthase and uses thereof

Identification and characterization of a novel alpha-amylase from maize endosperm

BRISTOL ROBERT L

Self-aligned via patterning with multi-colored photobuckets for back end of line (BEOL) interconnects

Self-aligned via patterning with multi-colored photobuckets for back end of line (BEOL) interconnects

Self-aligned via and plug patterning with photobuckets for back end of line (BEOL) interconnects

MYERS ALAN M

Diagonal hardmasks for improved overlay in fabricating back end of line (BEOL) interconnects

Diagonal hardmasks for improved overlay in fabricating back end of line (BEOL) interconnects

UNIV IOWA STATE RES FOUND

Dull1 coding for a novel starch synthase and uses thereof

Constitutive pseudohyphal growth yeast mutants

TAHOE RES LTD

Textile patterning for subtractively-patterned self-aligned interconnects, plugs, and vias