Inventor
VU QUAT T
US26 patents
Patents
26 patentsUS7078788B2Jul 18, 2006
Microelectronic substrates with integrated devices
INTEL CORP223 citations99
US6964889B2Nov 15, 2005
Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby
INTEL CORP153 citations99
US6902950B2Jun 7, 2005
Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby
INTEL CORP251 citations99
US6790704B2Sep 14, 2004
Method for capacitively coupling electronic devices
INTEL CORP188 citations99
US6734534B1May 11, 2004
Microelectronic substrate with integrated devices
INTEL CORP183 citations99
US6423570B1Jul 23, 2002
Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby
INTEL CORP352 citations99
US6586822B1Jul 1, 2003
Integrated core microelectronic package
INTEL CORP179 citations98
US7126207B2Oct 24, 2006
Capacitor with carbon nanotubes
INTEL CORP55 citations96
US6825063B2Nov 30, 2004
Integrated core microelectronic package
INTEL CORP73 citations96
US6303464B1Oct 16, 2001
Method and structure for reducing interconnect system capacitance through enclosed voids in a dielectric layer
INTEL CORP87 citations96
US6894399B2May 17, 2005
Microelectronic device having signal distribution functionality on an interfacial layer thereof
INTEL CORP130 citations95
US7071024B2Jul 4, 2006
Method for packaging a microelectronic device using on-die bond pad expansion
INTEL CORP93 citations94
US7696015B2Apr 13, 2010
Method of forming a stack of heat generating integrated circuit chips with intervening cooling integrated circuit chips
INTEL CORP15 citations93
US6310400B1Oct 30, 2001
Apparatus for capacitively coupling electronic devices
INTEL CORP23 citations93
US5583739ADec 10, 1996
Capacitor fabricated on a substrate containing electronic circuitry
INTEL CORP34 citations93
US5472900ADec 5, 1995
Capacitor fabricated on a substrate containing electronic circuitry
INTEL CORP30 citations93
US6992381B2Jan 31, 2006
Using external radiators with electroosmotic pumps for cooling integrated circuits
INTEL CORP16 citations92
US6981849B2Jan 3, 2006
Electro-osmotic pumps and micro-channels
INTEL CORP20 citations91
US6861274B2Mar 1, 2005
Method of making a SDI electroosmotic pump using nanoporous dielectric frit
INTEL CORP13 citations84
US7084495B2Aug 1, 2006
Electroosmotic pumps using porous frits for cooling integrated circuit stacks
INTEL CORP7 citations74
US6388328B1May 14, 2002
Capping layer in interconnect system and method for bonding the capping layer onto the interconnect system
INTEL CORP6 citations68
US7274106B2Sep 25, 2007
Packaged electroosmotic pumps using porous frits for cooling integrated circuits
INTEL CORP2 citations63
US6087728AJul 11, 2000
Interconnect design with controlled inductance
INTEL CORP2 citations54
US7723208B2May 25, 2010
Integrated re-combiner for electroosmotic pumps using porous frits
INTEL CORP0 citations52
US7667319B2Feb 23, 2010
Electroosmotic pump using nanoporous dielectric frit
INTEL CORP1 citations52
US7576432B2Aug 18, 2009
Using external radiators with electroosmotic pumps for cooling integrated circuits
INTEL CORP1 citations52