Inventor
VAIYAPURI VENKATESHWARAN
SG14 patents
⚠️ This page may combine multiple inventors who share the name “VAIYAPURI VENKATESHWARAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
13 patentsUS6274930B1Aug 14, 2001
Multi-chip module with stacked dice
MICRON TECHNOLOGY INC84 citations97
US6207467B1Mar 27, 2001
Multi-chip module with stacked dice
MICRON TECHNOLOGY INC107 citations97
US6507107B2Jan 14, 2003
Semiconductor/printed circuit board assembly
MICRON TECHNOLOGY INC69 citations95
US7084004B2Aug 1, 2006
MEMS heat pumps for integrated circuit heat dissipation
MICRON TECHNOLOGY INC23 citations92
US6869827B2Mar 22, 2005
Semiconductor/printed circuit board assembly, and computer system
MICRON TECHNOLOGY INC20 citations92
US6762079B2Jul 13, 2004
Methods for fabricating dual loc semiconductor die assembly employing floating lead finger structure
MICRON TECHNOLOGY INC21 citations92
US6629425B2Oct 7, 2003
MEMS heat pumps for integrated circuit heat dissipation
MICRON TECHNOLOGY INC32 citations92
US6469376B2Oct 22, 2002
Die support structure
MICRON TECHNOLOGY INC41 citations92
US7514776B2Apr 7, 2009
Semiconductor/printed circuit board assembly, and computer system
MICRON TECHNOLOGY INC9 citations83
US7427535B2Sep 23, 2008
Semiconductor/printed circuit board assembly, and computer system
MICRON TECHNOLOGY INC9 citations83
US6541846B2Apr 1, 2003
Dual LOC semiconductor assembly employing floating lead finger structure
MICRON TECHNOLOGY INC16 citations83
US6798055B2Sep 28, 2004
Die support structure
MICRON TECHNOLOGY INC12 citations73
US6844217B2Jan 18, 2005
Die support structure
MICRON TECHNOLOGY INC0 citations51