P

Inventor

KIM JIN HAN

KR101 patents
⚠️ This page may combine multiple inventors who share the name “KIM JIN HAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

23 patents
US6275315B1Aug 14, 2001

Apparatus for compensating for dispersion of optical fiber in an optical line

SAMSUNG ELECTRONICS CO LTD104 citations98
US7034719B2Apr 25, 2006

Data modulating method and apparatus, data demodulating method and apparatus, and code arranging method

SAMSUNG ELECTRONICS CO LTD11 citations92
US6205279B1Mar 20, 2001

Single mode optical fiber having multi-step core structure and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD29 citations92
US6519974B1Feb 18, 2003

Method for fabricating an optical fiber by simultaneous preform fusing and fiber drawing

SAMSUNG ELECTRONICS CO LTD21 citations91
US6445472B1Sep 3, 2002

Optical fiber subscriber network

SAMSUNG ELECTRONICS CO LTD28 citations88
US10281176B2May 7, 2019

Magnetic cooling apparatus and magnetic refrigerating system having the same

SAMSUNG ELECTRONICS CO LTD7 citations82
US9762119B2Sep 12, 2017

Switch driving circuit, and power factor correction circuit having the same

SAMSUNG ELECTRONICS CO LTD12 citations82
US7164373B2Jan 16, 2007

Data modulating method and apparatus, data demodulating method and apparatus, and code arranging method

SAMSUNG ELECTRONICS CO LTD4 citations74
US7142133B2Nov 28, 2006

Data modulating method and apparatus, data demodulating method and apparatus, and code arranging method

SAMSUNG ELECTRONICS CO LTD7 citations74
US10425033B2Sep 24, 2019

Motor driving apparatus and method of controlling the same

SAMSUNG ELECTRONICS CO LTD2 citations73
US10171022B2Jan 1, 2019

Motor driving device, an air conditioner including same and a control method therefor

SAMSUNG ELECTRONICS CO LTD6 citations73
US10030895B2Jul 24, 2018

Magnetic regenerator unit and magnetic cooling system with the same

SAMSUNG ELECTRONICS CO LTD4 citations73
US6945079B2Sep 20, 2005

Optical fiber drawing system for non-contact control of polarization mode dispersion of optical fiber

SAMSUNG ELECTRONICS CO LTD8 citations73
US6678433B2Jan 13, 2004

Apparatus and method for measuring residual stress and photoelastic effect of optical fiber

SAMSUNG ELECTRONICS CO LTD7 citations73
US9964344B2May 8, 2018

Magnetic cooling apparatus

SAMSUNG ELECTRONICS CO LTD2 citations72
US10563343B2Feb 18, 2020

Dryer and method for controlling the same

SAMSUNG ELECTRONICS CO LTD2 citations71
US9941785B2Apr 10, 2018

Power factor correction circuit and electronic product including the same

SAMSUNG ELECTRONICS CO LTD3 citations71
US9696830B2Jul 4, 2017

Method of manufacturing transparent circuit substrate for touch screen

SAMSUNG ELECTRONICS CO LTD2 citations70
US9275595B2Mar 1, 2016

Output buffer circuit and source driving circuit including the same

SAMSUNG ELECTRONICS CO LTD5 citations70
US7142136B2Nov 28, 2006

Data modulating method and apparatus, data demodulating method and apparatus, and code arranging method

SAMSUNG ELECTRONICS CO LTD3 citations69
US9928799B2Mar 27, 2018

Source driver and operating method thereof for controlling output timing of a data signal

SAMSUNG ELECTRONICS CO LTD5 citations67
US7450035B2Nov 11, 2008

Data modulating method and apparatus, data demodulating method and apparatus, and code arranging method

SAMSUNG ELECTRONICS CO LTD2 citations63
US7315263B2Jan 1, 2008

Data modulating method and apparatus, data demodulating method and apparatus, and code arranging method

SAMSUNG ELECTRONICS CO LTD2 citations63

AMKOR TECHNOLOGY INC

12 patents
US9490231B2Nov 8, 2016

Manufacturing method of semiconductor device and semiconductor device thereof

AMKOR TECHNOLOGY INC14 citations92
US8946883B2Feb 3, 2015

Wafer level fan-out package with a fiducial die

AMKOR TECHNOLOGY INC23 citations92
US10410993B2Sep 10, 2019

Manufacturing method of semiconductor device and semiconductor device thereof

AMKOR TECHNOLOGY INC4 citations84
US10056349B2Aug 21, 2018

Manufacturing method of semiconductor device and semiconductor device thereof

AMKOR TECHNOLOGY INC5 citations84
US9837376B2Dec 5, 2017

Manufacturing method of semiconductor device and semiconductor device thereof

AMKOR TECHNOLOGY INC4 citations84
US9741701B2Aug 22, 2017

Method of manufacturing a package-on-package type semiconductor package

AMKOR TECHNOLOGY INC4 citations84
US9818685B2Nov 14, 2017

Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers

AMKOR TECHNOLOGY INC4 citations83
US7091594B1Aug 15, 2006

Leadframe type semiconductor package having reduced inductance and its manufacturing method

AMKOR TECHNOLOGY INC13 citations83
US10008393B2Jun 26, 2018

Semiconductor device and manufacturing method thereof

AMKOR TECHNOLOGY INC7 citations81
US10290621B2May 14, 2019

Method of manufacturing a package-on-package type semiconductor package

AMKOR TECHNOLOGY INC2 citations73
US10199322B2Feb 5, 2019

Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers

AMKOR TECHNOLOGY INC1 citations72
US9406639B2Aug 2, 2016

Semiconductor package and manufacturing method thereof

AMKOR TECHNOLOGY INC2 citations63

AMKOR TECH SINGAPORE HOLDING PTE LTD

4 patents

KIM JIN-HAN

2 patents

DONGBU HITEK CO LTD

2 patents

KOREA TELECOMMUNICATION

1 patent

YOON YOUNG-SIK

1 patent

PACIFIC CORP

1 patent

HYNIX SEMICONDUCTOR INC

1 patent

CHOI JUNG HO

1 patent

KT CORP

1 patent

KOREA AEROSPACE RES INST

1 patent

Showing the top 50 of 101 patents by PatentIndex Score.