Inventor
KIM JIN HAN
KR101 patents
⚠️ This page may combine multiple inventors who share the name “KIM JIN HAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
23 patentsUS6275315B1Aug 14, 2001
Apparatus for compensating for dispersion of optical fiber in an optical line
SAMSUNG ELECTRONICS CO LTD104 citations98
US7034719B2Apr 25, 2006
Data modulating method and apparatus, data demodulating method and apparatus, and code arranging method
SAMSUNG ELECTRONICS CO LTD11 citations92
US6205279B1Mar 20, 2001
Single mode optical fiber having multi-step core structure and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD29 citations92
US6519974B1Feb 18, 2003
Method for fabricating an optical fiber by simultaneous preform fusing and fiber drawing
SAMSUNG ELECTRONICS CO LTD21 citations91
US6445472B1Sep 3, 2002
Optical fiber subscriber network
SAMSUNG ELECTRONICS CO LTD28 citations88
US10281176B2May 7, 2019
Magnetic cooling apparatus and magnetic refrigerating system having the same
SAMSUNG ELECTRONICS CO LTD7 citations82
US9762119B2Sep 12, 2017
Switch driving circuit, and power factor correction circuit having the same
SAMSUNG ELECTRONICS CO LTD12 citations82
US7164373B2Jan 16, 2007
Data modulating method and apparatus, data demodulating method and apparatus, and code arranging method
SAMSUNG ELECTRONICS CO LTD4 citations74
US7142133B2Nov 28, 2006
Data modulating method and apparatus, data demodulating method and apparatus, and code arranging method
SAMSUNG ELECTRONICS CO LTD7 citations74
US10425033B2Sep 24, 2019
Motor driving apparatus and method of controlling the same
SAMSUNG ELECTRONICS CO LTD2 citations73
US10171022B2Jan 1, 2019
Motor driving device, an air conditioner including same and a control method therefor
SAMSUNG ELECTRONICS CO LTD6 citations73
US10030895B2Jul 24, 2018
Magnetic regenerator unit and magnetic cooling system with the same
SAMSUNG ELECTRONICS CO LTD4 citations73
US6945079B2Sep 20, 2005
Optical fiber drawing system for non-contact control of polarization mode dispersion of optical fiber
SAMSUNG ELECTRONICS CO LTD8 citations73
US6678433B2Jan 13, 2004
Apparatus and method for measuring residual stress and photoelastic effect of optical fiber
SAMSUNG ELECTRONICS CO LTD7 citations73
US9964344B2May 8, 2018
Magnetic cooling apparatus
SAMSUNG ELECTRONICS CO LTD2 citations72
US10563343B2Feb 18, 2020
Dryer and method for controlling the same
SAMSUNG ELECTRONICS CO LTD2 citations71
US9941785B2Apr 10, 2018
Power factor correction circuit and electronic product including the same
SAMSUNG ELECTRONICS CO LTD3 citations71
US9696830B2Jul 4, 2017
Method of manufacturing transparent circuit substrate for touch screen
SAMSUNG ELECTRONICS CO LTD2 citations70
US9275595B2Mar 1, 2016
Output buffer circuit and source driving circuit including the same
SAMSUNG ELECTRONICS CO LTD5 citations70
US7142136B2Nov 28, 2006
Data modulating method and apparatus, data demodulating method and apparatus, and code arranging method
SAMSUNG ELECTRONICS CO LTD3 citations69
US9928799B2Mar 27, 2018
Source driver and operating method thereof for controlling output timing of a data signal
SAMSUNG ELECTRONICS CO LTD5 citations67
US7450035B2Nov 11, 2008
Data modulating method and apparatus, data demodulating method and apparatus, and code arranging method
SAMSUNG ELECTRONICS CO LTD2 citations63
US7315263B2Jan 1, 2008
Data modulating method and apparatus, data demodulating method and apparatus, and code arranging method
SAMSUNG ELECTRONICS CO LTD2 citations63
AMKOR TECHNOLOGY INC
12 patentsUS9490231B2Nov 8, 2016
Manufacturing method of semiconductor device and semiconductor device thereof
AMKOR TECHNOLOGY INC14 citations92
US8946883B2Feb 3, 2015
Wafer level fan-out package with a fiducial die
AMKOR TECHNOLOGY INC23 citations92
US10410993B2Sep 10, 2019
Manufacturing method of semiconductor device and semiconductor device thereof
AMKOR TECHNOLOGY INC4 citations84
US10056349B2Aug 21, 2018
Manufacturing method of semiconductor device and semiconductor device thereof
AMKOR TECHNOLOGY INC5 citations84
US9837376B2Dec 5, 2017
Manufacturing method of semiconductor device and semiconductor device thereof
AMKOR TECHNOLOGY INC4 citations84
US9741701B2Aug 22, 2017
Method of manufacturing a package-on-package type semiconductor package
AMKOR TECHNOLOGY INC4 citations84
US9818685B2Nov 14, 2017
Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers
AMKOR TECHNOLOGY INC4 citations83
US7091594B1Aug 15, 2006
Leadframe type semiconductor package having reduced inductance and its manufacturing method
AMKOR TECHNOLOGY INC13 citations83
US10008393B2Jun 26, 2018
Semiconductor device and manufacturing method thereof
AMKOR TECHNOLOGY INC7 citations81
US10290621B2May 14, 2019
Method of manufacturing a package-on-package type semiconductor package
AMKOR TECHNOLOGY INC2 citations73
US10199322B2Feb 5, 2019
Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers
AMKOR TECHNOLOGY INC1 citations72
US9406639B2Aug 2, 2016
Semiconductor package and manufacturing method thereof
AMKOR TECHNOLOGY INC2 citations63
AMKOR TECH SINGAPORE HOLDING PTE LTD
4 patentsUS12327812B2Jun 10, 2025
Semiconductor device and manufacturing method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US12255197B2Mar 18, 2025
Package-on-package type semiconductor package
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US11948808B2Apr 2, 2024
Semiconductor device and manufacturing method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US11901332B2Feb 13, 2024
Semiconductor device and manufacturing method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
KIM JIN-HAN
2 patentsDONGBU HITEK CO LTD
2 patentsKOREA TELECOMMUNICATION
1 patentYOON YOUNG-SIK
1 patentPACIFIC CORP
1 patentHYNIX SEMICONDUCTOR INC
1 patentCHOI JUNG HO
1 patentKT CORP
1 patentKOREA AEROSPACE RES INST
1 patentShowing the top 50 of 101 patents by PatentIndex Score.