Inventor

XU ZHENG

US277 patents

⚠️ This page may combine multiple inventors who share the name “XU ZHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

XU ZHENG

APPLIED MATERIALS INC

Method of preventing diffusion of copper through a tantalum-comprising barrier layer

Vault shaped target and magnetron operable in two sputtering modes

Pulsed sputtering with a small rotating magnetron

Filling narrow apertures and forming interconnects with a metal utilizing a crystallographically oriented liner layer

Semiconductor device having a low thermal budget metal filling and planarization of contacts, vias and trenches

Sustained self-sputtering reactor having an increased density plasma

Integrated process for copper via filling using a magnetron and target producing highly energetic ions

Integrated process for copper via filling

Darkspace shield for improved RF transmission in inductively coupled plasma sources for sputter deposition

End point detection for sputtering and resputtering

Use of pulsed-DC wafer bias for filling vias/trenches with metal in HDP physical vapor deposition

Method of depositing a tantalum nitride/tantalum diffusion barrier layer system

Method of depositing a metal seed layer on semiconductor substrates

Multi-step magnetron sputtering process

Operating a magnetron sputter reactor in two modes

Damage-free sculptured coating deposition

Magnet array in conjunction with rotating magnetron for plasma sputtering

Integrated copper fill process

Processes to improve electroplating fill

Coils for generating a plasma and for sputtering

Plasma density modulator for improved plasma density uniformity and thickness uniformity in an ionized metal plasma source

Apparatus for filling apertures in a film layer on a semiconductor substrate

Aluminum hole filling method using ionized metal adhesion layer

Silicon-doped titanium wetting layer for aluminum plug

Apparatus and method for enhancing uniformity of a metal film formed on a substrate with the aid of an inductively coupled plasma

Cover layer for a substrate support chuck and method of fabricating same

Slotted RF coil shield for plasma deposition system

Electrically floating shield in a plasma reactor

Synchronous modulation bias sputter method and apparatus for complete planarization of metal films

Method and apparatus for improving semiconductor wafer surface temperature uniformity

Method and apparatus for forming metal interconnects

Multiple step ionized metal plasma deposition process for conformal step coverage

Deposition process for coating or filling re-entry shaped contact holes

Method of depositing a metal seed layer on semiconductor substrates

Feedthrough overlap coil

Sputtering method to generate ionized metal plasma using electron beams and magnetic field

Method to eliminate coil sputtering in an ICP source

Titanium nitride barrier layers

Apparatus for sputtering material onto a workpiece with the aid of a plasma

Reliable sustained self-sputtering

Titanium nitride barrier layers

Magnet design for a sputtering chamber

Method for forming aluminum contacts

SIGA PHARMACEUTICALS INC

Treatment or prophylaxis of diseases caused by pilus-forming bacteria

Treatment or prophylaxis of diseases caused by pilus-forming bacteria

FINKELSTEIN YURI

Service level agreement based storage access

UNIV WASHINGTON

Compounds and pharmaceutical compositions for the treatment and prophylaxis of bacterial infections

(unassigned)

Treatment or prophylaxis of diseases caused by pilus-forming bacteria

SOLARCITY CORP

Method of installing a strain relief apparatus to a solar cell

SILEVO INC

Module fabrication of solar cells with low resistivity electrodes