P

Inventor

FORSTER JOHN

US37 patents
⚠️ This page may combine multiple inventors who share the name “FORSTER JOHN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

APPLIED MATERIALS INC

26 patents
US6344419B1Feb 5, 2002

Pulsed-mode RF bias for sidewall coverage improvement

APPLIED MATERIALS INC180 citations99
US6306265B1Oct 23, 2001

High-density plasma for ionized metal deposition capable of exciting a plasma wave

APPLIED MATERIALS INC138 citations99
US6217721B1Apr 17, 2001

Filling narrow apertures and forming interconnects with a metal utilizing a crystallographically oriented liner layer

APPLIED MATERIALS INC206 citations99
US5962923AOct 5, 1999

Semiconductor device having a low thermal budget metal filling and planarization of contacts, vias and trenches

APPLIED MATERIALS INC142 citations99
US5897752AApr 27, 1999

Wafer bias ring in a sustained self-sputtering reactor

APPLIED MATERIALS INC186 citations99
US6264812B1Jul 24, 2001

Method and apparatus for generating a plasma

APPLIED MATERIALS INC98 citations98
US6193855B1Feb 27, 2001

Use of modulated inductive power and bias power to reduce overhang and improve bottom coverage

APPLIED MATERIALS INC125 citations98
US6673724B2Jan 6, 2004

Pulsed-mode RF bias for side-wall coverage improvement

APPLIED MATERIALS INC49 citations96
US6368469B1Apr 9, 2002

Coils for generating a plasma and for sputtering

APPLIED MATERIALS INC48 citations96
US6297595B1Oct 2, 2001

Method and apparatus for generating a plasma

APPLIED MATERIALS INC76 citations96
US6228229B1May 8, 2001

Method and apparatus for generating a plasma

APPLIED MATERIALS INC74 citations96
US6136095AOct 24, 2000

Apparatus for filling apertures in a film layer on a semiconductor substrate

APPLIED MATERIALS INC52 citations96
US5763851AJun 9, 1998

Slotted RF coil shield for plasma deposition system

APPLIED MATERIALS INC93 citations96
US6176981B1Jan 23, 2001

Wafer bias ring controlling the plasma potential in a sustained self-sputtering reactor

APPLIED MATERIALS INC21 citations93
US5685941ANov 11, 1997

Inductively coupled plasma reactor with top electrode for enhancing plasma ignition

APPLIED MATERIALS INC62 citations93
US7569125B2Aug 4, 2009

Shields usable with an inductively coupled plasma reactor

APPLIED MATERIALS INC16 citations92
US7041201B2May 9, 2006

Sidewall magnet improving uniformity of inductively coupled plasma and shields used therewith

APPLIED MATERIALS INC31 citations92
US6783639B2Aug 31, 2004

Coils for generating a plasma and for sputtering

APPLIED MATERIALS INC21 citations92
US6313027B1Nov 6, 2001

Method for low thermal budget metal filling and planarization of contacts vias and trenches

APPLIED MATERIALS INC33 citations92
US7658802B2Feb 9, 2010

Apparatus and a method for cleaning a dielectric film

APPLIED MATERIALS INC8 citations84
US7704887B2Apr 27, 2010

Remote plasma pre-clean with low hydrogen pressure

APPLIED MATERIALS INC10 citations83
US10099245B2Oct 16, 2018

Process kit for deposition and etching

APPLIED MATERIALS INC2 citations73
US5516403AMay 14, 1996

Reversing orientation of sputtering screen to avoid contamination

APPLIED MATERIALS INC10 citations69
US12080519B2Sep 3, 2024

Smart dynamic load simulator for RF power delivery control system

APPLIED MATERIALS INC0 citations60
US11170982B2Nov 9, 2021

Methods and apparatus for producing low angle depositions

APPLIED MATERIALS INC0 citations49
US12205791B2Jan 21, 2025

Rating substrate support assemblies based on impedance circuit electron flow using machine learning

APPLIED MATERIALS INC0 citations44

DOW AGROSCIENCES LLC

6 patents

VERSARAKE LLC

2 patents

WESTROC INC

1 patent

FU JIANMING

1 patent

FORSTER JOHN

1 patent