Inventor
LIAU HSIANG WAN
MY3 patents
Patents
3 patentsUS7651938B2Jan 26, 2010
Void reduction in indium thermal interface material
ADVANCED MICRO DEVICES INC15 citations90
US7999394B2Aug 16, 2011
Void reduction in indium thermal interface material
ADVANCED MICRO DEVICES INC10 citations82
US7482697B2Jan 27, 2009
Double-sided waffle pack
ADVANCED MICRO DEVICES INC0 citations39