Inventor

DAMA BIPIN

US20 patents

⚠️ This page may combine multiple inventors who share the name “DAMA BIPIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DAMA BIPIN

CISCO TECH INC

Interposer configuration with thermally isolated regions for temperature-sensitive opto-electronic components

Interposer configuration with thermally isolated regions for temperature-sensitive opto-electronic components

Self-aligning optical connector assembly

Direct printed circuit routing to stacked opto-electrical IC packages

Reference-less clock and data recovery circuit

Single mode fiber array connector for opto-electronic transceivers

Wafer scale packaging platform for transceivers

Self-aligning connectorized fiber array assembly

Molded glass lid for wafer level packaging of opto-electronic assemblies

Enhanced low inductance interconnections between electronic and opto-electronic integrated circuits

Molded glass lid for wafer level packaging of opto-electronic assemblies

SHASTRI KALPENDU

Wafer scale packaging platform for transceivers

HDMI TMDS optical signal transmission using PAM technique

Enhanced low inductance interconnections between electronic and opto-electronic integrated circuits

Optical interconnection arrangement for high speed, high density communication systems

LIGHTWIRE INC

Optical modulator utilizing multi-level signaling

Common electronic dispersion compensation arrangement for use with multiple optical communication channels

SIOPTICAL INC

Integrated approach for design, simulation and verification of monolithic, silicon-based opto-electronic circuits

AAYUNA INC

High density opto-electronic interconnection configuration utilizing passive alignment

METZ PETER C

Optical modulator utilizing unary encoding and auxiliary modulator section for load balancing