Inventor
KINSMAN LARRY D
US192 patents
⚠️ This page may combine multiple inventors who share the name “KINSMAN LARRY D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
49 patentsUS6934065B2Aug 23, 2005
Microelectronic devices and methods for packaging microelectronic devices
MICRON TECHNOLOGY INC162 citations99
US6885107B2Apr 26, 2005
Flip-chip image sensor packages and methods of fabrication
MICRON TECHNOLOGY INC284 citations99
US6833612B2Dec 21, 2004
Flip-chip image sensor packages
MICRON TECHNOLOGY INC88 citations99
US6797616B2Sep 28, 2004
Circuit boards containing vias and methods for producing same
MICRON TECHNOLOGY INC175 citations99
US6780746B2Aug 24, 2004
Method for fabricating a chip scale package using wafer level processing and devices resulting therefrom
MICRON TECHNOLOGY INC88 citations99
US6774486B2Aug 10, 2004
Circuit boards containing vias and methods for producing same
MICRON TECHNOLOGY INC176 citations99
US6744137B2Jun 1, 2004
Bumped die and wire bonded board-on-chip package
MICRON TECHNOLOGY INC77 citations99
US6717245B1Apr 6, 2004
Chip scale packages performed by wafer level processing
MICRON TECHNOLOGY INC170 citations99
US6414391B1Jul 2, 2002
Module assembly for stacked BGA packages with a common bus bar in the assembly
MICRON TECHNOLOGY INC87 citations99
US6297960B1Oct 2, 2001
Heat sink with alignment and retaining features
MICRON TECHNOLOGY INC155 citations99
US6297548B1Oct 2, 2001
Stackable ceramic FBGA for high thermal applications
MICRON TECHNOLOGY INC259 citations99
US6294839B1Sep 25, 2001
Apparatus and methods of packaging and testing die
MICRON TECHNOLOGY INC352 citations99
US6246110B1Jun 12, 2001
Downset lead frame for semiconductor packages
MICRON TECHNOLOGY INC119 citations99
US6215175B1Apr 10, 2001
Semiconductor package having metal foil die mounting plate
MICRON TECHNOLOGY INC180 citations99
US6172419B1Jan 9, 2001
Low profile ball grid array package
MICRON TECHNOLOGY INC323 citations99
US6159764ADec 12, 2000
Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages
MICRON TECHNOLOGY INC283 citations99
US6153924ANov 28, 2000
Multilayered lead frame for semiconductor package
MICRON TECHNOLOGY INC223 citations99
US5696033ADec 9, 1997
Method for packaging a semiconductor die
MICRON TECHNOLOGY INC193 citations99
US6709893B2Mar 23, 2004
Interconnections for a semiconductor device and method for forming same
MICRON TECHNOLOGY INC94 citations98
US6563217B2May 13, 2003
Module assembly for stacked BGA packages
MICRON TECHNOLOGY INC76 citations98
US6133068AOct 17, 2000
Increasing the gap between a lead frame and a semiconductor die
MICRON TECHNOLOGY INC100 citations98
US5302891AApr 12, 1994
Discrete die burn-in for non-packaged die
MICRON TECHNOLOGY INC224 citations98
US5155067AOct 13, 1992
Packaging for a semiconductor die
MICRON TECHNOLOGY INC106 citations97
US7638813B2Dec 29, 2009
Methods of fabrication for flip-chip image sensor packages
MICRON TECHNOLOGY INC33 citations96
US7122390B2Oct 17, 2006
Methods of fabrication for flip-chip image sensor packages
MICRON TECHNOLOGY INC35 citations96
US6979596B2Dec 27, 2005
Method of fabricating a tape having apertures under a lead frame for conventional IC packages
MICRON TECHNOLOGY INC27 citations96
US6964886B2Nov 15, 2005
Methods of fabrication for flip-chip image sensor packages
MICRON TECHNOLOGY INC37 citations96
US6956295B2Oct 18, 2005
Flip-chip image sensor packages
MICRON TECHNOLOGY INC28 citations96
US6940141B2Sep 6, 2005
Flip-chip image sensor packages and methods of fabrication
MICRON TECHNOLOGY INC38 citations96
US6900079B2May 31, 2005
Method for fabricating a chip scale package using wafer level processing
MICRON TECHNOLOGY INC41 citations96
US6838768B2Jan 4, 2005
Module assembly for stacked BGA packages
MICRON TECHNOLOGY INC35 citations96
US6760224B2Jul 6, 2004
Heat sink with alignment and retaining features
MICRON TECHNOLOGY INC60 citations96
US6650007B2Nov 18, 2003
Stackable ceramic fbga for high thermal applications
MICRON TECHNOLOGY INC36 citations96
US6528408B2Mar 4, 2003
Method for bumped die and wire bonded board-on-chip package
MICRON TECHNOLOGY INC52 citations96
US6512302B2Jan 28, 2003
Apparatus and methods of packaging and testing die
MICRON TECHNOLOGY INC46 citations96
US6482674B1Nov 19, 2002
Semiconductor package having metal foil die mounting plate
MICRON TECHNOLOGY INC49 citations96
US6414374B2Jul 2, 2002
Semiconductor device including edge bond pads and methods
MICRON TECHNOLOGY INC62 citations96
US6410406B1Jun 25, 2002
Semiconductor device including edge bond pads and methods
MICRON TECHNOLOGY INC28 citations96
US6380631B2Apr 30, 2002
Apparatus and methods of packaging and testing die
MICRON TECHNOLOGY INC37 citations96
US6372552B1Apr 16, 2002
Semiconductor device, ball grid array connection system, and method of making
MICRON TECHNOLOGY INC46 citations96
US6268650B1Jul 31, 2001
Semiconductor device, ball grid array connection system, and method of making
MICRON TECHNOLOGY INC54 citations96
US6265773B1Jul 24, 2001
Vertically mountable and alignable semiconductor device, assembly, and methods
MICRON TECHNOLOGY INC28 citations96
US6239012B1May 29, 2001
Vertically mountable semiconductor device and methods
MICRON TECHNOLOGY INC41 citations96
US6235551B1May 22, 2001
Semiconductor device including edge bond pads and methods
MICRON TECHNOLOGY INC39 citations96
US6215177B1Apr 10, 2001
Tape under frame for conventional-type IC package assembly
MICRON TECHNOLOGY INC49 citations96
US6147411ANov 14, 2000
Vertical surface mount package utilizing a back-to-back semiconductor device module
MICRON TECHNOLOGY INC40 citations96
US6088237AJul 11, 2000
Semiconductor device socket, assembly and methods
MICRON TECHNOLOGY INC43 citations96
US6002165ADec 14, 1999
Multilayered lead frame for semiconductor packages
MICRON TECHNOLOGY INC57 citations96
US5997378ADec 7, 1999
Method for evacuating and sealing field emission displays
MICRON TECHNOLOGY INC51 citations96
(unassigned)
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