Inventor

LEE CLIFF C

US3 patents

⚠️ This page may combine multiple inventors who share the name “LEE CLIFF C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MICROSOFT TECHNOLOGY LICENSING LLC

1 patent

US12027361B2Jul 2, 2024

High temperature superconductor-based interconnect systems with a lowered thermal load for interconnecting cryogenic electronics with non-cryogenic electronics

MICROSOFT TECHNOLOGY LICENSING LLC2 citations70

HOSSAIN MD ALTAF

1 patent

US8674235B2Mar 18, 2014

Microelectronic substrate for alternate package functionality

HOSSAIN MD ALTAF4 citations67

INTEL CORP

1 patent

US9961769B2May 1, 2018

Microelectronic substrate for alternate package functionality

INTEL CORP0 citations47