Inventor

KO CHENG-WEI

TW2 patents

⚠️ This page may combine multiple inventors who share the name “KO CHENG-WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TYNTEK CORP

1 patent

US6720664B1Apr 13, 2004

Submount-holder for flip chip package

TYNTEK CORP13 citations72

HUANG SHIAO-HWA

1 patent

US8395667B2Mar 12, 2013

Method for monitoring video signal transmission and the device thereof

HUANG SHIAO-HWA0 citations28