Inventor
MINAMITANI SHOZO
JP24 patents
⚠️ This page may combine multiple inventors who share the name “MINAMITANI SHOZO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD
17 patentsUS6544377B1Apr 8, 2003
Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD40 citations95
US6706130B1Mar 16, 2004
Method and device for frictional connection and holding tool used for the frictional connection device
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD31 citations93
US6467670B2Oct 22, 2002
Method and apparatus for mounting component
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD19 citations92
US6246789B1Jun 12, 2001
Component mounting apparatus and method
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD31 citations92
US6193136B1Feb 27, 2001
Component mounting method and apparatus
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD32 citations92
US7296727B2Nov 20, 2007
Apparatus and method for mounting electronic components
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD27 citations91
US6439447B1Aug 27, 2002
Bump joining judging device and method, and semiconductor component production device and method
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD23 citations91
US7020953B2Apr 4, 2006
Apparatus and method for mounting component
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD30 citations90
US7437818B2Oct 21, 2008
Component mounting method
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD12 citations84
US7219419B2May 22, 2007
Component mounting apparatus including a polishing device
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD15 citations84
US6506222B2Jan 14, 2003
Method and apparatus for mounting component
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD11 citations74
US6264704B1Jul 24, 2001
Method and apparatus for mounting component
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD7 citations74
US6321973B1Nov 27, 2001
Bump joining method
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD8 citations73
US6572005B2Jun 3, 2003
Bump-joining method
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD3 citations62
US7290331B2Nov 6, 2007
Component mounting apparatus and component mounting method
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD4 citations61
US7281322B2Oct 16, 2007
Component mounting method
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD6 citations61
US7229854B2Jun 12, 2007
Electronic component mounting method and apparatus and ultrasonic bonding head
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD0 citations51
PANASONIC CORP
7 patentsUS7637714B2Dec 29, 2009
Apparatus and method for removing semiconductor chip
PANASONIC CORP34 citations92
US7827677B2Nov 9, 2010
Component mounting apparatus
PANASONIC CORP15 citations84
US7549567B2Jun 23, 2009
Component mounting tool, and method and apparatus for mounting component using this tool
PANASONIC CORP6 citations74
US7490652B2Feb 17, 2009
Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components
PANASONIC CORP5 citations72
US8001678B2Aug 23, 2011
Component mounting apparatus
PANASONIC CORP4 citations62
US7938929B2May 10, 2011
Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components
PANASONIC CORP4 citations61
US7861908B2Jan 4, 2011
Component mounting method, component mounting apparatus, and ultrasonic bonding head
PANASONIC CORP0 citations51