Inventor
ORII YASUMITSU
JP15 patents
Patents
15 patentsUS5878942AMar 9, 1999
Soldering method and soldering apparatus
IBM40 citations90
US7674651B2Mar 9, 2010
Mounting method for semiconductor parts on circuit substrate
IBM13 citations79
US10797011B2Oct 6, 2020
Method of forming solder bumps
IBM3 citations73
US10115692B2Oct 30, 2018
Method of forming solder bumps
IBM2 citations73
US9586281B2Mar 7, 2017
Forming a solder joint between metal layers
IBM2 citations72
US9698119B2Jul 4, 2017
Interfacial alloy layer for improving electromigration (EM) resistance in solder joints
IBM2 citations71
US9391034B2Jul 12, 2016
Interfacial alloy layer for improving electromigration (EM) resistance in solder joints
IBM2 citations61
US10840202B2Nov 17, 2020
Method of forming solder bumps
IBM0 citations52
US10833035B2Nov 10, 2020
Method of forming solder bumps
IBM0 citations52
US9466533B2Oct 11, 2016
Semiconductor structure including a through electrode, and method for forming the same
IBM1 citations52
US9373545B2Jun 21, 2016
Semiconductor structure including a through electrode, and method for forming the same
IBM0 citations52
US10252363B2Apr 9, 2019
Forming a solder joint between metal layers
IBM0 citations51
US7605075B2Oct 20, 2009
Multilayer circuit board and method of manufacturing the same
IBM4 citations51
US9099315B2Aug 4, 2015
Mounting structure and mounting structure manufacturing method
IBM0 citations41
US7682936B2Mar 23, 2010
Reduction in thickness of semiconductor component on substrate
IBM0 citations39