Inventor
GOPALAN RAMESH
US15 patents
⚠️ This page may combine multiple inventors who share the name “GOPALAN RAMESH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
11 patentsUS11114326B2Sep 7, 2021
Substrate chucking and dechucking methods
APPLIED MATERIALS INC6 citations71
US10685819B2Jun 16, 2020
Measuring concentrations of radicals in semiconductor processing
APPLIED MATERIALS INC4 citations68
US11521839B2Dec 6, 2022
Inline measurement of process gas dissociation using infrared absorption
APPLIED MATERIALS INC0 citations62
US12033875B2Jul 9, 2024
Wireless in-situ real-time measurement of electrostatic chucking force in semiconductor wafer processing
APPLIED MATERIALS INC0 citations60
US11373890B2Jun 28, 2022
Wireless in-situ real-time measurement of electrostatic chucking force in semiconductor wafer processing
APPLIED MATERIALS INC1 citations60
US11355325B2Jun 7, 2022
Methods and systems for monitoring input power for process control in semiconductor process systems
APPLIED MATERIALS INC0 citations59
US11047035B2Jun 29, 2021
Protective yttria coating for semiconductor equipment parts
APPLIED MATERIALS INC1 citations56
US10656100B2May 19, 2020
Surface acoustic wave sensors in semiconductor processing equipment
APPLIED MATERIALS INC0 citations51
US10094788B2Oct 9, 2018
Surface acoustic wave sensors in semiconductor processing equipment
APPLIED MATERIALS INC0 citations51
US10513008B2Dec 24, 2019
Chemical mechanical polishing smart ring
APPLIED MATERIALS INC0 citations47
US12557595B2Feb 17, 2026
Methods for electrostatic chuck ceramic surfacing
APPLIED MATERIALS INC0 citations43
LAM RES CORP
3 patentsUS7413988B1Aug 19, 2008
Method and apparatus for detecting planarization of metal films prior to clearing
LAM RES CORP6 citations70
US7690966B1Apr 6, 2010
Method and apparatus for detecting planarization of metal films prior to clearing
LAM RES CORP0 citations48
US7040952B1May 9, 2006
Method for reducing or eliminating de-lamination of semiconductor wafer film layers during a chemical mechanical planarization process
LAM RES CORP0 citations48