Inventor
HUANG TZU-FANG
US27 patents
⚠️ This page may combine multiple inventors who share the name “HUANG TZU-FANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
19 patentsUS6593247B1Jul 15, 2003
Method of depositing low k films using an oxidizing plasma
APPLIED MATERIALS INC129 citations99
US6790788B2Sep 14, 2004
Method of improving stability in low k barrier layers
APPLIED MATERIALS INC79 citations98
US7030041B2Apr 18, 2006
Adhesion improvement for low k dielectrics
APPLIED MATERIALS INC45 citations94
US7160821B2Jan 9, 2007
Method of depositing low k films
APPLIED MATERIALS INC25 citations92
US7132369B2Nov 7, 2006
Method of forming a low-K dual damascene interconnect structure
APPLIED MATERIALS INC27 citations92
US6914014B2Jul 5, 2005
Method for curing low dielectric constant film using direct current bias
APPLIED MATERIALS INC32 citations92
US6815373B2Nov 9, 2004
Use of cyclic siloxanes for hardness improvement of low k dielectric films
APPLIED MATERIALS INC41 citations92
US6806207B2Oct 19, 2004
Method of depositing low K films
APPLIED MATERIALS INC34 citations92
US6632735B2Oct 14, 2003
Method of depositing low dielectric constant carbon doped silicon oxide
APPLIED MATERIALS INC37 citations92
US6699784B2Mar 2, 2004
Method for depositing a low k dielectric film (K>3.5) for hard mask application
APPLIED MATERIALS INC42 citations91
US7435685B2Oct 14, 2008
Method of forming a low-K dual damascene interconnect structure
APPLIED MATERIALS INC13 citations83
US6936309B2Aug 30, 2005
Hardness improvement of silicon carboxy films
APPLIED MATERIALS INC3 citations63
US6911403B2Jun 28, 2005
Methods of reducing plasma-induced damage for advanced plasma CVD dielectrics
APPLIED MATERIALS INC5 citations63
US7700486B2Apr 20, 2010
Oxide-like seasoning for dielectric low k films
APPLIED MATERIALS INC3 citations62
US7115508B2Oct 3, 2006
Oxide-like seasoning for dielectric low k films
APPLIED MATERIALS INC4 citations62
US7588803B2Sep 15, 2009
Multi step ebeam process for modifying dielectric materials
APPLIED MATERIALS INC3 citations61
US7459404B2Dec 2, 2008
Adhesion improvement for low k dielectrics
APPLIED MATERIALS INC2 citations60
US12288704B2Apr 29, 2025
Methods and apparatus for processing a substrate
APPLIED MATERIALS INC0 citations55
US7049249B2May 23, 2006
Method of improving stability in low k barrier layers
APPLIED MATERIALS INC0 citations52