Inventor

M SAAD HICHEM

US78 patents

⚠️ This page may combine multiple inventors who share the name “M SAAD HICHEM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

M SAAD HICHEM

APPLIED MATERIALS INC

Methods and apparatus for forming HDP-CVD PSG film used for advanced pre-metal dielectric layer applications

Methods and systems for forming at least one dielectric layer

Decreasing the etch rate of silicon nitride by carbon addition

In-situ oxide capping after CVD low k deposition

Post treatment of low k dielectric films

Reduction of mobile ion and metal contamination in HDP-CVD chambers using chamber seasoning film depositions

Method for forming a low thermal budget spacer

Barrier layer deposition using HDP-CVD

Techniques for the use of amorphous carbon (APF) for various etch and litho integration scheme

Barrier layer deposition using HDP-CVD

Tunable ground planes in plasma chambers

Adhesion improvement for low k dielectrics

Memory cell having stressed layers

Air gap integration scheme

Integration process for fabricating stressed transistor structure

Method to deposit functionally graded dielectric films via chemical vapor deposition using viscous precursors

Silicon carbide deposited by high density plasma chemical-vapor deposition with bias

Techniques for the use of amorphous carbon (APF) for various etch and litho integration schemes

High efficiency UV curing system

Blocker plate bypass to distribute gases in a chemical vapor deposition system

Nitrogen treatment of polished halogen-doped silicon glass

Method for improving barrier layer adhesion to HDP-FSG thin films

Nitrogen-free antireflective coating for use with photolithographic patterning

Method of depositing an amorphous carbon film for etch hardmask application

Liquid precursors for the CVD deposition of amorphous carbon films

Nitrogen-free dielectric anti-reflective coating and hardmask

CMP pad thickness and profile monitoring system

Method for depositing an amorphous carbon film with improved density and step coverage

Method to improve the step coverage and pattern loading for dielectric films

Reduction of hillocks prior to dielectric barrier deposition in Cu damascene

Method of making a fluoro-organosilicate layer

Method to increase the compressive stress of PECVD dielectric films

Boron derived materials deposition method

Multi-stage curing of low K nano-porous films

Interface engineering to improve adhesion between low k stacks

Method to increase the compressive stress of PECVD silicon nitride films

Method and apparatus for reducing charge density on a dielectric coated substrate after exposure to a large area electron beam

Selective copper-silicon-nitride layer formation for an improved dielectric film/copper line interface

Clean process for an electron beam source

Method of forming low dielectric constant porous films

Reduction of hillocks prior to dielectric barrier deposition in Cu damascene

Nitrogen-free dielectric anti-reflective coating and hardmask

Apparatus for improving barrier layer adhesion to HDP-FSG thin films

BALSEANU MIHAELA

Method to increase silicon nitride tensile stress using nitrogen plasma in-situ treatment and ex-situ UV cure

Method to increase tensile stress of silicon nitride films using a post PECVD deposition UV cure

Method to increase tensile stress of silicon nitride films using a post PECVD deposition UV cure

XU HUIWEN

Method to minimize wet etch undercuts and provide pore sealing of extreme low k (k&lt;2.5) dielectrics

KASZUBA ANDRZEI

Apparatus and method for exposing a substrate to UV radiation using asymmetric reflectors

HUH JEONG-UK

Method of depositing boron nitride and boron nitride-derived materials

PADHI DEENESH

Methods to improve the in-film defectivity of PECVD amorphous carbon films

Method to minimize wet etch undercuts and provide pore sealing of extreme low k (k<2.5) dielectrics