P

Inventor

LEE CHIEN-HSING

TW65 patents
⚠️ This page may combine multiple inventors who share the name “LEE CHIEN-HSING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SOLID STATE SYSTEM CO LTD

23 patents
US9126827B2Sep 8, 2015

Microelectromechanical system (MEMS) device and fabrication method thereof

SOLID STATE SYSTEM CO LTD47 citations98
US8934649B1Jan 13, 2015

Micro electro-mechanical system (MEMS) microphone device with multi-sensitivity outputs and circuit with the MEMS device

SOLID STATE SYSTEM CO LTD29 citations94
US7951636B2May 31, 2011

Method for fabricating micro-electro-mechanical system (MEMS) device

SOLID STATE SYSTEM CO LTD41 citations93
US7200038B2Apr 3, 2007

Nonvolatile memory structure

SOLID STATE SYSTEM CO LTD19 citations92
US7046549B2May 16, 2006

Nonvolatile memory structure

SOLID STATE SYSTEM CO LTD37 citations92
US7020018B2Mar 28, 2006

Nonvolatile memory device and method for fabricating the same

SOLID STATE SYSTEM CO LTD26 citations92
US10250998B2Apr 2, 2019

Micro-electro-mechanical systems (MEMS) device and method for fabricating the MEMS

SOLID STATE SYSTEM CO LTD14 citations85
US8043897B2Oct 25, 2011

Method for forming micro-electro-mechanical system (MEMS) package

SOLID STATE SYSTEM CO LTD12 citations84
US8030112B2Oct 4, 2011

Method for fabricating MEMS device

SOLID STATE SYSTEM CO LTD13 citations84
US7795063B2Sep 14, 2010

Micro-electro-mechanical systems (MEMS) device and process for fabricating the same

SOLID STATE SYSTEM CO LTD19 citations84
US7119394B2Oct 10, 2006

Nonvolatile memory device and method for fabricating the same

SOLID STATE SYSTEM CO LTD14 citations84
US10390145B1Aug 20, 2019

Micro electro mechanical system (MEMS) microphone

SOLID STATE SYSTEM CO LTD12 citations83
US9271087B1Feb 23, 2016

Microelectro-mechanical systems (MEMS) microphone package device and MEMS packaging method thereof

SOLID STATE SYSTEM CO LTD8 citations82
US7061042B2Jun 13, 2006

Double-cell memory device

SOLID STATE SYSTEM CO LTD8 citations74
US6987298B2Jan 17, 2006

Circuit layout and structure for a non-volatile memory

SOLID STATE SYSTEM CO LTD9 citations74
US9955268B2Apr 24, 2018

Micro-electrical-mechanical system (MEMS) microphone

SOLID STATE SYSTEM CO LTD2 citations73
US11312616B1Apr 26, 2022

Structure of micro-electro-mechanical-system microphone and method for fabricating the same

SOLID STATE SYSTEM CO LTD2 citations72
US10841710B1Nov 17, 2020

Package structure of micro-electro-mechanical-system microphone package and method for packaging the same

SOLID STATE SYSTEM CO LTD2 citations72
US8673732B2Mar 18, 2014

Method for fabricating micro-electro-mechanical systems (MEMS) device

SOLID STATE SYSTEM CO LTD2 citations63
US7233527B2Jun 19, 2007

Nonvolatile memory structure

SOLID STATE SYSTEM CO LTD2 citations63
US7094649B2Aug 22, 2006

Method for forming multi-level mask ROM cell and NAND multi-level mask ROM

SOLID STATE SYSTEM CO LTD5 citations63
US11317220B2Apr 26, 2022

Structure of micro-electro-mechanical-system microphone

SOLID STATE SYSTEM CO LTD0 citations62
US11172287B2Nov 9, 2021

Structure of micro-electro-mechanical-system microphone and method for fabricating the same

SOLID STATE SYSTEM CO LTD1 citations62

TAIWAN SEMICONDUCTOR MFG CO LTD

13 patents
US10276697B1Apr 30, 2019

Negative capacitance FET with improved reliability performance

TAIWAN SEMICONDUCTOR MFG CO LTD19 citations94
US10937783B2Mar 2, 2021

Semiconductor device and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US11728332B2Aug 15, 2023

Semiconductor device and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11043489B2Jun 22, 2021

Semiconductor device and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10868132B2Dec 15, 2020

Semiconductor device including standard cells with header/footer switch including negative capacitance

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10741678B2Aug 11, 2020

Semiconductor device and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10734472B2Aug 4, 2020

Negative capacitance FET with improved reliability performance

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US12317515B2May 27, 2025

Memory device and semiconductor die having the memory device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11631755B2Apr 18, 2023

Semiconductor device and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11322577B2May 3, 2022

Negative capacitance FET with improved reliability performance

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US10930769B2Feb 23, 2021

Semiconductor device and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12211836B2Jan 28, 2025

Semiconductor device and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11114540B2Sep 7, 2021

Semiconductor device including standard cells with header/footer switch including negative capacitance

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

LEE CHIEN-HSING

5 patents

HSIEH TSUNG-MIN

5 patents

UNITED MICROELECTRONICS CORP

3 patents

NANYA PLASTICS CORP

1 patent

Showing the top 50 of 65 patents by PatentIndex Score.