Inventor
POMPEO FRANK L
US43 patents
⚠️ This page may combine multiple inventors who share the name “POMPEO FRANK L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
42 patentsUS6444496B1Sep 3, 2002
Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof
IBM123 citations99
US5956576ASep 21, 1999
Enhanced protection of semiconductors with dual surface seal
IBM142 citations98
US6275381B1Aug 14, 2001
Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof
IBM65 citations96
US5968670AOct 19, 1999
Enhanced ceramic ball grid array using in-situ solder stretch with spring
IBM63 citations96
US5881945AMar 16, 1999
Multi-layer solder seal band for semiconductor substrates and process
IBM57 citations96
US5881944AMar 16, 1999
Multi-layer solder seal band for semiconductor substrates
IBM53 citations96
US5533256AJul 9, 1996
Method for directly joining a chip to a heat sink
IBM102 citations96
US5471027ANov 28, 1995
Method for forming chip carrier with a single protective encapsulant
IBM132 citations96
US5560934AOct 1, 1996
Cleavable diepoxide for removable epoxy compositions
IBM51 citations95
US5512613AApr 30, 1996
Cleavable diepoxide for removable epoxy compositions
IBM77 citations95
US7806341B2Oct 5, 2010
Structure for implementing secure multichip modules for encryption applications
IBM16 citations92
US7281667B2Oct 16, 2007
Method and structure for implementing secure multichip modules for encryption applications
IBM18 citations92
US7079393B2Jul 18, 2006
Fluidic cooling systems and methods for electronic components
IBM44 citations92
US6518674B2Feb 11, 2003
Temporary attach article and method for temporary attach of devices to a substrate
IBM23 citations92
US6255139B1Jul 3, 2001
Method for providing a thermal path through particles embedded in a thermal cap
IBM19 citations92
US6111314AAug 29, 2000
Thermal cap with embedded particles
IBM23 citations92
US5975409ANov 2, 1999
Ceramic ball grid array using in-situ solder stretch
IBM36 citations92
US5964396AOct 12, 1999
Enhanced ceramic ball grid array using in-situ solder stretch with clip
IBM36 citations92
US5773561AJun 30, 1998
Polymer sealants/adhesives and use thereof in electronic package assembly
IBM43 citations92
US10842043B1Nov 17, 2020
Fabricating coolant-cooled heat sinks with internal thermally-conductive fins
IBM22 citations91
US6274214B1Aug 14, 2001
Microelectronic package module with temporary lid
IBM19 citations91
US6054008AApr 25, 2000
Process for adhesively attaching a temporary lid to a microelectronic package
IBM23 citations91
US7544527B2Jun 9, 2009
Method and apparatus for providing optoelectronic communication with an electronic device
IBM12 citations84
US7472836B2Jan 6, 2009
Method and structure for implementing secure multichip modules for encryption applications
IBM11 citations84
US7245022B2Jul 17, 2007
Semiconductor module with improved interposer structure and method for forming the same
IBM17 citations84
US7084496B2Aug 1, 2006
Method and apparatus for providing optoelectronic communication with an electronic device
IBM14 citations84
US7445141B2Nov 4, 2008
Solder interconnection array with optimal mechanical integrity
IBM8 citations74
US11156409B2Oct 26, 2021
Coolant-cooled heat sinks with internal thermally-conductive fins joined to the cover
IBM6 citations71
US10368441B2Jul 30, 2019
Method and apparatus for strain relieving surface mount attached connectors
IBM1 citations71
US9627784B1Apr 18, 2017
Method and apparatus for strain relieving surface mount attached connectors
IBM2 citations71
US7900809B2Mar 8, 2011
Solder interconnection array with optimal mechanical integrity
IBM3 citations63
US6303400B1Oct 16, 2001
Temporary attach article and method for temporary attach of devices to a substrate
IBM2 citations63
US7128472B2Oct 31, 2006
Method and apparatus for providing optoelectronic communication with an electronic device
IBM3 citations62
US11404287B2Aug 2, 2022
Fixture facilitating heat sink fabrication
IBM0 citations61
US10978313B2Apr 13, 2021
Fixture facilitating heat sink fabrication
IBM0 citations61
US7299530B2Nov 27, 2007
Ball grid array rework using a continuous belt furnace
IBM4 citations61
US12005148B2Jun 11, 2024
Coolant-cooled heat sink(s) with associated ultra-violet light assembly
IBM0 citations60
US11940271B2Mar 26, 2024
High power device fault localization via die surface contouring
IBM0 citations60
US7882623B2Feb 8, 2011
Apparatus for removing interconnects to separate two parts of a workpiece
IBM0 citations51
US7452215B2Nov 18, 2008
Ball grid array rework using a continuous belt furnace
IBM0 citations51
US10750615B2Aug 18, 2020
Method and apparatus for strain relieving surface mount attached connectors
IBM0 citations50
US9974179B2May 15, 2018
Method and apparatus for strain relieving surface mount attached connectors
IBM0 citations50