Inventor
RAY SUDIPTA K
US41 patents
⚠️ This page may combine multiple inventors who share the name “RAY SUDIPTA K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
36 patentsUS6258625B1Jul 10, 2001
Method of interconnecting electronic components using a plurality of conductive studs
IBM243 citations99
US5436412AJul 25, 1995
Interconnect structure having improved metallization
IBM148 citations99
US6270363B1Aug 7, 2001
Z-axis compressible polymer with fine metal matrix suspension
IBM105 citations98
US5251806AOct 12, 1993
Method of forming dual height solder interconnections
IBM144 citations98
US5130779AJul 14, 1992
Solder mass having conductive encapsulating arrangement
IBM185 citations98
US6333563B1Dec 25, 2001
Electrical interconnection package and method thereof
IBM85 citations97
US6878608B2Apr 12, 2005
Method of manufacture of silicon based package
IBM54 citations96
US6335210B1Jan 1, 2002
Baseplate for chip burn-in and/of testing, and method thereof
IBM64 citations96
US6283359B1Sep 4, 2001
Method for enhancing fatigue life of ball grid arrays
IBM53 citations96
US6235996B1May 22, 2001
Interconnection structure and process module assembly and rework
IBM65 citations96
US5209817AMay 11, 1993
Selective plating method for forming integral via and wiring layers
IBM297 citations96
US4489364ADec 18, 1984
Chip carrier with embedded engineering change lines with severable periodically spaced bridging connectors on the chip supporting surface
IBM87 citations96
US4463059AJul 31, 1984
Layered metal film structures for LSI chip carriers adapted for solder bonding and wire bonding
IBM60 citations95
US7806341B2Oct 5, 2010
Structure for implementing secure multichip modules for encryption applications
IBM16 citations92
US7281667B2Oct 16, 2007
Method and structure for implementing secure multichip modules for encryption applications
IBM18 citations92
US6574859B2Jun 10, 2003
Interconnection process for module assembly and rework
IBM18 citations92
US6216937B1Apr 17, 2001
Process and apparatus to remove closely spaced chips on a multi-chip module
IBM31 citations92
US6158644ADec 12, 2000
Method for enhancing fatigue life of ball grid arrays
IBM43 citations92
US5543584AAug 6, 1996
Structure for repairing electrical lines
IBM21 citations92
US5243140ASep 7, 1993
Direct distribution repair and engineering change system
IBM33 citations92
US5153408AOct 6, 1992
Method and structure for repairing electrical lines
IBM33 citations92
US4985310AJan 15, 1991
Multilayered metallurgical structure for an electronic component
IBM51 citations92
US6429388B1Aug 6, 2002
High density column grid array connections and method thereof
IBM53 citations91
US6220499B1Apr 24, 2001
Method for assembling a chip carrier to a semiconductor device
IBM30 citations91
US7472836B2Jan 6, 2009
Method and structure for implementing secure multichip modules for encryption applications
IBM11 citations84
US6784086B2Aug 31, 2004
Lead-free solder structure and method for high fatigue life
IBM16 citations84
US6713686B2Mar 30, 2004
Apparatus and method for repairing electronic packages
IBM16 citations84
US6984792B2Jan 10, 2006
Dielectric interposer for chip to substrate soldering
IBM9 citations74
US6548909B2Apr 15, 2003
Method of interconnecting electronic components using a plurality of conductive studs
IBM11 citations74
US6360938B2Mar 26, 2002
Process and apparatus to remove closely spaced chips on a multi-chip module
IBM12 citations73
US5961032AOct 5, 1999
Method of fabrication of a multi-component solder column by blocking a portion of a through hole in a mold
IBM12 citations73
US6657313B1Dec 2, 2003
Dielectric interposer for chip to substrate soldering
IBM7 citations71
US4576659AMar 18, 1986
Process for inhibiting metal migration during heat cycling of multilayer thin metal film structures
IBM9 citations70
US6350625B1Feb 26, 2002
Optoelectronic packaging submount arrangement providing 90 degree electrical conductor turns and method of forming thereof
IBM6 citations63
US6827505B2Dec 7, 2004
Optoelectronic package structure and process for planar passive optical and optoelectronic devices
IBM4 citations60
US6908025B2Jun 21, 2005
Preparing MCM hat for removal
IBM1 citations52