Inventor
MIURA MUNEO
SG3 patents
Patents
3 patentsUS9728426B2Aug 8, 2017
Method for producing resin-encapsulated electronic component, bump-formed plate-like member, resin-encapsulated electronic component, and method for producing bump-formed plate-like member
TOWA CORP2 citations67
US7439101B2Oct 21, 2008
Resin encapsulation molding method for semiconductor device
TOWA CORP5 citations49
US9580827B2Feb 28, 2017
Method for producing electronic component, bump-formed plate-like member, electronic component, and method for producing bump-formed plate-like member
TOWA CORP1 citations46