Inventor
IMURA FUMITO
JP4 patents
Patents
4 patentsUS11056410B2Jul 6, 2021
Method of manufacturing semiconductor package using alignment mark on wafer
AIST0 citations47
US10163819B2Dec 25, 2018
Surface mount package and manufacturing method thereof
AIST0 citations47
US10163674B2Dec 25, 2018
Circular support substrate for semiconductor
AIST0 citations47
US10304675B2May 28, 2019
System for integrating preceding steps and subsequent steps
AIST0 citations36