Inventor
HO BANG-CHEIN
TW17 patents
⚠️ This page may combine multiple inventors who share the name “HO BANG-CHEIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
10 patentsUS7235348B2Jun 26, 2007
Water soluble negative tone photoresist
TAIWAN SEMICONDUCTOR MFG38 citations92
US6905621B2Jun 14, 2005
Method for preventing the etch transfer of sidelobes in contact hole patterns
TAIWAN SEMICONDUCTOR MFG52 citations92
US6900134B1May 31, 2005
Method for forming openings in a substrate using bottom antireflective coatings
TAIWAN SEMICONDUCTOR MFG28 citations92
US6664011B2Dec 16, 2003
Hole printing by packing and unpacking using alternating phase-shifting masks
TAIWAN SEMICONDUCTOR MFG55 citations92
US6488509B1Dec 3, 2002
Plug filling for dual-damascene process
TAIWAN SEMICONDUCTOR MFG49 citations92
US6998198B2Feb 14, 2006
Contact hole printing by packing and unpacking
TAIWAN SEMICONDUCTOR MFG6 citations63
US7972957B2Jul 5, 2011
Method of making openings in a layer of a semiconductor device
TAIWAN SEMICONDUCTOR MFG2 citations62
US7419771B2Sep 2, 2008
Method for forming a finely patterned resist
TAIWAN SEMICONDUCTOR MFG6 citations62
US7749904B2Jul 6, 2010
Method of forming a dual damascene structure
TAIWAN SEMICONDUCTOR MFG4 citations60
US7094686B2Aug 22, 2006
Contact hole printing by packing and unpacking
TAIWAN SEMICONDUCTOR MFG2 citations56