Inventor

MURAYAMA KEI

JP127 patents

⚠️ This page may combine multiple inventors who share the name “MURAYAMA KEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MURAYAMA KEI

SHINKO ELECTRIC IND CO

Electronic parts packaging structure and method of manufacturing the same

Semiconductor device and mount structure thereof

Semiconductor device having circuit pattern along outer periphery of sealing resin and related processes

Wiring board mounting a capacitor

Electronic parts packaging structure having mutually connected electronic parts that are buried in a insulating film

Semiconductor chip and method of manufacturing the same

Method of manufacturing substrate

Electronic component device

Electronic component embedded substrate and method for manufacturing the same

Electronic parts packaging structure and method of manufacturing the same

Semiconductor device manufacturing method

Semiconductor device and method of production of same

Mounting structure for semiconductor devices

Semiconductor device to be mounted on main circuit board and process for manufacturing same device

Semiconductor device having a chip mounted on a rectangular substrate

Package structure for semiconductor chip

Semiconductor chip package structure

Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film

Electronic parts packaging structure and method of manufacturing the same

Semiconductor device and production method thereof

Semiconductor device having a carbon fiber reinforced resin as a heat radiation plate having a concave portion

Semiconductor device and process of producing same

Semiconductor device

Heat radiation package and semiconductor device

Silicon interposer and method for manufacturing the same

Method of manufacturing substrate

Electronic component and method for manufacturing the same

Wiring substrate

Electronic component and method for manufacturing the same

Method of manufacturing wiring board having a semiconductor thereon

Light-emitting device and method for manufacturing the same

Semiconductor device and method of manufacturing semiconductor device

Method for manufacturing semiconductor device

Semiconductor device and manufacturing method of semiconductor device

Optical waveguide mounting member, substrate, semiconductor device, method of manufacturing optical waveguide mounting member, and method of manufacturing substrate

Method for manufacturing semiconductor package having electrodes penetrating through semiconductor wafer

Method for manufacturing thin semiconductor chip

Electronic parts packaging structure and method of manufacturing the same

Semiconductor package

Method for mounting semiconductor chip onto circuit board

Electronic parts packaging structure and method of manufacturing the same

Electronic parts packaging structure and method of manufacturing the same

SUNOHARA MASAHIRO

Method of manufacturing wiring substrate

Wiring board with switching function and method of manufacturing the same

Method of manufacturing wiring substrate and method of manufacturing semiconductor device

SHINKO ELECTRIC ELECTRIC IND CO LTD

Semiconductor inspecting device

MURAYAMA KEI

Semiconductor device having an element mounted on a substrate and an electrical component connected to the element

PANASONIC CORP

Positioning receiver

SHINKO ELECTRIC INDUTRIES CO L

Method of production of multilayer circuit board with built-in semiconductor chip

SHINKO ELECTRONIC IND CO LTD

Semiconductor device and process of producing same