Inventor

BURGESS GUY F

US7 patents

⚠️ This page may combine multiple inventors who share the name “BURGESS GUY F”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FLIPCHIP INT LLC

3 patents

US9627254B2Apr 18, 2017

Method for building vertical pillar interconnect

FLIPCHIP INT LLC7 citations79

US9070747B2Jun 30, 2015

Electroplating using dielectric bridges

FLIPCHIP INT LLC1 citations45

US8980743B2Mar 17, 2015

Method for applying a final metal layer for wafer level packaging and associated device

FLIPCHIP INT LLC1 citations41

CURTIS ANTHONY

2 patents

US8754524B2Jun 17, 2014

Wafer-level interconnect for high mechanical reliability applications

CURTIS ANTHONY6 citations79

US8143722B2Mar 27, 2012

Wafer-level interconnect for high mechanical reliability applications

CURTIS ANTHONY11 citations79

RECHE JOHN J H

1 patent

US8058163B2Nov 15, 2011

Enhanced reliability for semiconductor devices using dielectric encasement

RECHE JOHN J H4 citations51

BURGESS GUY F

1 patent

US9831201B2Nov 28, 2017

Methods for forming pillar bumps on semiconductor wafers

BURGESS GUY F0 citations18