Inventor
DARVEAUX ROBERT F
US28 patents
⚠️ This page may combine multiple inventors who share the name “DARVEAUX ROBERT F”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AMKOR TECHNOLOGY INC
18 patentsUS6124637ASep 26, 2000
Carrier strip and molded flex circuit ball grid array and method of making
AMKOR TECHNOLOGY INC107 citations99
US5985695ANov 16, 1999
Method of making a molded flex circuit ball grid array
AMKOR TECHNOLOGY INC134 citations99
US5859475AJan 12, 1999
Carrier strip and molded flex circuit ball grid array
AMKOR TECHNOLOGY INC166 citations99
US7253503B1Aug 7, 2007
Integrated circuit device packages and substrates for making the packages
AMKOR TECHNOLOGY INC120 citations98
US6580159B1Jun 17, 2003
Integrated circuit device packages and substrates for making the packages
AMKOR TECHNOLOGY INC107 citations97
US6331451B1Dec 18, 2001
Methods of making thin integrated circuit device packages with improved thermal performance and substrates for making the packages
AMKOR TECHNOLOGY INC95 citations97
US6201305B1Mar 13, 2001
Making solder ball mounting pads on substrates
AMKOR TECHNOLOGY INC245 citations97
US7576401B1Aug 18, 2009
Direct glass attached on die optical module
AMKOR TECHNOLOGY INC58 citations96
US6400033B1Jun 4, 2002
Reinforcing solder connections of electronic devices
AMKOR TECHNOLOGY INC58 citations96
US7126218B1Oct 24, 2006
Embedded heat spreader ball grid array
AMKOR TECHNOLOGY INC108 citations95
US6833609B1Dec 21, 2004
Integrated circuit device packages and substrates for making the packages
AMKOR TECHNOLOGY INC23 citations92
US7911017B1Mar 22, 2011
Direct glass attached on die optical module
AMKOR TECHNOLOGY INC33 citations91
US8017436B1Sep 13, 2011
Thin substrate fabrication method and structure
AMKOR TECHNOLOGY INC33 citations90
US8383950B1Feb 26, 2013
Metal etch stop fabrication method and structure
AMKOR TECHNOLOGY INC8 citations84
US8365611B1Feb 5, 2013
Bend test method and apparatus for flip chip devices
AMKOR TECHNOLOGY INC9 citations84
US7923645B1Apr 12, 2011
Metal etch stop fabrication method and structure
AMKOR TECHNOLOGY INC13 citations84
US10347562B1Jul 9, 2019
Methods and structures for increasing the allowable die size in TMV packages
AMKOR TECHNOLOGY INC7 citations83
US10714408B2Jul 14, 2020
Semiconductor devices and methods of making semiconductor devices
AMKOR TECHNOLOGY INC1 citations72
MOTOROLA INC
5 patentsUS5203076AApr 20, 1993
Vacuum infiltration of underfill material for flip-chip devices
MOTOROLA INC170 citations96
US5455446AOct 3, 1995
Leaded semiconductor package having temperature controlled lead length
MOTOROLA INC24 citations92
US5152451AOct 6, 1992
Controlled solder oxidation process
MOTOROLA INC34 citations92
US5552636ASep 3, 1996
Discrete transitor assembly
MOTOROLA INC12 citations74
US5411199AMay 2, 1995
Method for attaching a shield
MOTOROLA INC15 citations72