Inventor
MILES BARRY M
US17 patents
⚠️ This page may combine multiple inventors who share the name “MILES BARRY M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MOTOROLA INC
16 patentsUS5535101AJul 9, 1996
Leadless integrated circuit package
MOTOROLA INC351 citations99
US5019673AMay 28, 1991
Flip-chip package for integrated circuits
MOTOROLA INC211 citations98
US5696666ADec 9, 1997
Low profile exposed die chip carrier package
MOTOROLA INC304 citations97
US5166772ANov 24, 1992
Transfer molded semiconductor device package with integral shield
MOTOROLA INC281 citations97
US5006673AApr 9, 1991
Fabrication of pad array carriers from a universal interconnect structure
MOTOROLA INC130 citations97
US4940181AJul 10, 1990
Pad grid array for receiving a solder bumped chip carrier
MOTOROLA INC193 citations97
US5831832ANov 3, 1998
Molded plastic ball grid array package
MOTOROLA INC78 citations96
US5721450AFeb 24, 1998
Moisture relief for chip carriers
MOTOROLA INC73 citations96
US5296738AMar 22, 1994
Moisture relief for chip carrier
MOTOROLA INC61 citations96
US5153385AOct 6, 1992
Transfer molded semiconductor package with improved adhesion
MOTOROLA INC62 citations96
US6242802B1Jun 5, 2001
Moisture enhanced ball grid array package
MOTOROLA INC72 citations95
US5134462AJul 28, 1992
Flexible film chip carrier having a flexible film substrate and means for maintaining planarity of the substrate
MOTOROLA INC22 citations92
US5077633ADec 31, 1991
Grounding an ultra high density pad array chip carrier
MOTOROLA INC42 citations92
US5031027AJul 9, 1991
Shielded electrical circuit
MOTOROLA INC49 citations92
US5515188AMay 7, 1996
Method of manufacturing a liquid crystal display device in which a vacuum reservoir attached to the LCD is placed in a conformable container or bag
MOTOROLA INC17 citations73
US5198264AMar 30, 1993
Method for adhering polyimide to a substrate
MOTOROLA INC5 citations61