Inventor
KADOGUCHI SOHICHI
JP4 patents
Patents
4 patentsUS7404513B2Jul 29, 2008
Wire bonds having pressure-absorbing balls
TEXAS INSTRUMENTS INC13 citations78
US6768212B2Jul 27, 2004
Semiconductor packages and methods for manufacturing such semiconductor packages
TEXAS INSTRUMENTS INC10 citations70
US7926698B2Apr 19, 2011
Spot heat wirebonding
TEXAS INSTRUMENTS INC0 citations47
US7677432B2Mar 16, 2010
Spot heat wirebonding
TEXAS INSTRUMENTS INC0 citations47