Inventor
NAGASAWA MEGUMU
JP10 patents
⚠️ This page may combine multiple inventors who share the name “NAGASAWA MEGUMU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NITTO DENKO CORP
9 patentsUS5990546ANov 23, 1999
Chip scale package type of semiconductor device
NITTO DENKO CORP187 citations98
US5814894ASep 29, 1998
Semiconductor device, production method thereof, and tape carrier for semiconductor device used for producing the semiconductor device
NITTO DENKO CORP205 citations97
US6373000B2Apr 16, 2002
Double-sided circuit board and multilayer wiring board comprising the same and process for producing double-sided circuit board
NITTO DENKO CORP55 citations95
US6335076B1Jan 1, 2002
Multi-layer wiring board and method for manufacturing the same
NITTO DENKO CORP26 citations92
US6333469B1Dec 25, 2001
Wafer-scale package structure and circuit board attached thereto
NITTO DENKO CORP34 citations92
US6310391B1Oct 30, 2001
Mounted structure of circuit board and multi-layer circuit board therefor
NITTO DENKO CORP38 citations92
US6258449B1Jul 10, 2001
Low-thermal expansion circuit board and multilayer circuit board
NITTO DENKO CORP37 citations92
US5294835AMar 15, 1994
Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
NITTO DENKO CORP18 citations71
US6462282B1Oct 8, 2002
Circuit board for mounting bare chip
NITTO DENKO CORP2 citations63