Inventor
SUN WEN-BIN
CN6 patents
⚠️ This page may combine multiple inventors who share the name “SUN WEN-BIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED CHIP ENG TECH INC
4 patentsUS7279782B2Oct 9, 2007
FBGA and COB package structure for image sensor
ADVANCED CHIP ENG TECH INC21 citations91
US7224061B2May 29, 2007
Package structure
ADVANCED CHIP ENG TECH INC8 citations72
US7525139B2Apr 28, 2009
Image sensor with a protection layer
ADVANCED CHIP ENG TECH INC7 citations71
US7476565B2Jan 13, 2009
Method for forming filling paste structure of WL package
ADVANCED CHIP ENG TECH INC3 citations60