Inventor
BYUN HAK-KYOON
KR9 patents
⚠️ This page may combine multiple inventors who share the name “BYUN HAK-KYOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
6 patentsUS7795743B2Sep 14, 2010
Wiring substrate having variously sized ball pads, semiconductor package having the wiring substrate, and stack package using the semiconductor package
SAMSUNG ELECTRONICS CO LTD37 citations92
US7624498B2Dec 1, 2009
Apparatus for detaching a semiconductor chip from a tape
SAMSUNG ELECTRONICS CO LTD10 citations81
US7541680B2Jun 2, 2009
Semiconductor device package
SAMSUNG ELECTRONICS CO LTD13 citations81
US8759967B2Jun 24, 2014
Semiconductor package and package on package having the same
SAMSUNG ELECTRONICS CO LTD4 citations72
US9111926B2Aug 18, 2015
Semiconductor package and package on package having the same
SAMSUNG ELECTRONICS CO LTD2 citations62
US9245863B2Jan 26, 2016
Semiconductor packaging apparatus formed from semiconductor package including first and second solder balls having different heights
SAMSUNG ELECTRONICS CO LTD1 citations49