Inventor
MA YU-CHEN
TW10 patents
Patents
10 patentsUS11322437B2May 3, 2022
Flip chip interconnection and circuit board thereof
CHIPBOND TECHNOLOGY CORP2 citations69
US9247635B2Jan 26, 2016
Flexible substrate
CHIPBOND TECHNOLOGY CORP2 citations56
US12543262B2Feb 3, 2026
Thin film circuit board
CHIPBOND TECHNOLOGY CORP0 citations53
US11812554B2Nov 7, 2023
Layout structure of a flexible circuit board
CHIPBOND TECHNOLOGY CORP0 citations48
US11581283B2Feb 14, 2023
Flip chip package and circuit board thereof
CHIPBOND TECHNOLOGY CORP0 citations48
US11309238B2Apr 19, 2022
Layout structure of a flexible circuit board
CHIPBOND TECHNOLOGY CORP0 citations48
US10999928B1May 4, 2021
Circuit board
CHIPBOND TECHNOLOGY CORP0 citations48
US10993319B1Apr 27, 2021
Chip package and circuit board thereof
CHIPBOND TECHNOLOGY CORP0 citations48
US12412825B2Sep 9, 2025
Semiconductor package
CHIPBOND TECHNOLOGY CORP0 citations46
US11606860B2Mar 14, 2023
Flexible circuit board
CHIPBOND TECHNOLOGY CORP0 citations46