Inventor
CHOU WEN-FU
TW8 patents
⚠️ This page may combine multiple inventors who share the name “CHOU WEN-FU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHIPBOND TECHNOLOGY CORP
7 patentsUS11322437B2May 3, 2022
Flip chip interconnection and circuit board thereof
CHIPBOND TECHNOLOGY CORP2 citations69
US11812554B2Nov 7, 2023
Layout structure of a flexible circuit board
CHIPBOND TECHNOLOGY CORP0 citations48
US11581283B2Feb 14, 2023
Flip chip package and circuit board thereof
CHIPBOND TECHNOLOGY CORP0 citations48
US11309238B2Apr 19, 2022
Layout structure of a flexible circuit board
CHIPBOND TECHNOLOGY CORP0 citations48
US10999928B1May 4, 2021
Circuit board
CHIPBOND TECHNOLOGY CORP0 citations48
US10993319B1Apr 27, 2021
Chip package and circuit board thereof
CHIPBOND TECHNOLOGY CORP0 citations48
US11350518B2May 31, 2022
Method of attaching heat sinks to a circuit tape
CHIPBOND TECHNOLOGY CORP0 citations37