Inventor
LIN CHIEN-CHIH
TW51 patents
⚠️ This page may combine multiple inventors who share the name “LIN CHIEN-CHIH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
19 patentsUS10867861B2Dec 15, 2020
Fin field-effect transistor device and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11996468B2May 28, 2024
Multi-gate device fabrication and structures thereof
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US11217679B2Jan 4, 2022
Semiconductor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12142668B2Nov 12, 2024
Semiconductor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12063768B2Aug 13, 2024
Transistors with multiple threshold voltages
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11605638B2Mar 14, 2023
Transistors with multiple threshold voltages
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US9136356B2Sep 15, 2015
Non-planar field effect transistor having a semiconductor fin and method for manufacturing
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations62
US12283610B2Apr 22, 2025
Structure and formation method of semiconductor device with epitaxial structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12218227B2Feb 4, 2025
Semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11742416B2Aug 29, 2023
Semiconductor structure and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11670551B2Jun 6, 2023
Interface trap charge density reduction
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US12101921B2Sep 24, 2024
SRAM speed and margin optimization via spacer tuning
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US11508738B2Nov 22, 2022
SRAM speed and margin optimization via spacer tuning
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10115596B2Oct 30, 2018
Method of fabricating a semiconductor device having a T-shape in the metal gate line-end
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9780213B2Oct 3, 2017
Semiconductor device having a reversed T-shaped profile in the metal gate line-end
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10991630B2Apr 27, 2021
Semiconductor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10504898B2Dec 10, 2019
Fin field-effect transistor structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9331178B2May 3, 2016
Method for manufacturing non-planar field effect transistor having a semiconductor fin
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations51
US12261203B2Mar 25, 2025
Semiconductor device structure with gate stack and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations47
LIN CHIEN-CHIH
5 patentsUSD731874SJun 16, 2015
Connector of mold
LIN CHIEN-CHIH14 citations83
US8320097B2Nov 27, 2012
Electrostatic discharge structure for touch panel module
LIN CHIEN-CHIH2 citations54
US9153709B2Oct 6, 2015
Junction box, power system and method for controlling the same
LIN CHIEN-CHIH1 citations51
US7606285B2Oct 20, 2009
Chuck device for electrical discharge machine
LIN CHIEN-CHIH1 citations51
US8928175B2Jan 6, 2015
Junction box, energy system and method for controlling the same
LIN CHIEN-CHIH0 citations41
INVENTEC PUDONG TECH CORP
3 patentsMEDIATEK SINGAPORE PTE LTD
3 patentsUS10170435B2Jan 1, 2019
Guard ring structure and method for forming the same
MEDIATEK SINGAPORE PTE LTD1 citations72
US9947627B2Apr 17, 2018
Guard ring structure and method for forming the same
MEDIATEK SINGAPORE PTE LTD1 citations61
US9397032B2Jul 19, 2016
Guard ring structure and method for forming the same
MEDIATEK SINGAPORE PTE LTD1 citations61
NAN YA PLASTICS CORP
3 patentsUS12358200B2Jul 15, 2025
Method for producing a polyester film
NAN YA PLASTICS CORP0 citations62
US11707876B2Jul 25, 2023
Polyester film and method for producing the same
NAN YA PLASTICS CORP0 citations62
US11911951B2Feb 27, 2024
Matte film for hot pressing and manufacturing method thereof
NAN YA PLASTICS CORP0 citations51
MEDIATEK INC
3 patentsUS9847294B2Dec 19, 2017
Semiconductor device allowing metal layer routing formed directly under metal pad
MEDIATEK INC0 citations52
US9627336B2Apr 18, 2017
Semiconductor device allowing metal layer routing formed directly under metal pad
MEDIATEK INC0 citations52
US9455226B2Sep 27, 2016
Semiconductor device allowing metal layer routing formed directly under metal pad
MEDIATEK INC0 citations52
CHERNG JIN TECHNOLOGY CO LTD
2 patentsGENESYS LOGIC INC
2 patentsUNITED MICROELECTRONICS CORP
2 patentsSU WEI-FANG
1 patentQUALCOMM INC
1 patentFAN SHENG-HUNG
1 patentCHERNG JIN TECH CO LTD
1 patentPRIMAX ELECTRONICS LTD
1 patentPEGATRON CORP
1 patentHIWIN MIKROSYSTEM CORP
1 patentLEE CHUNG-I
1 patentShowing the top 50 of 51 patents by PatentIndex Score.