Inventor
SUMITA KAZUAKI
JP32 patents
⚠️ This page may combine multiple inventors who share the name “SUMITA KAZUAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHINETSU CHEMICAL CO
29 patentsUS6225704B1May 1, 2001
Flip-chip type semiconductor device
SHINETSU CHEMICAL CO55 citations95
US6479167B2Nov 12, 2002
Sealing material for flip-chip semiconductor device, and flip-chip semiconductor device made therewith
SHINETSU CHEMICAL CO31 citations92
US6429238B1Aug 6, 2002
Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device
SHINETSU CHEMICAL CO28 citations92
US6376100B1Apr 23, 2002
Flip-chip type semiconductor device underfill material and flip-chip type semiconductor device
SHINETSU CHEMICAL CO22 citations92
US6376923B1Apr 23, 2002
Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device
SHINETSU CHEMICAL CO38 citations92
US6372839B1Apr 16, 2002
Flip-chip type semiconductor device underfill
SHINETSU CHEMICAL CO21 citations92
US6294271B1Sep 25, 2001
Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device
SHINETSU CHEMICAL CO37 citations92
US6323263B1Nov 27, 2001
Semiconductor sealing liquid epoxy resin compositions
SHINETSU CHEMICAL CO32 citations89
US6310120B1Oct 30, 2001
Flip-chip type semiconductor device sealing material
SHINETSU CHEMICAL CO16 citations84
US7094844B2Aug 22, 2006
Liquid epoxy resin composition and semiconductor device
SHINETSU CHEMICAL CO3 citations63
US7067930B2Jun 27, 2006
Liquid epoxy resin composition and semiconductor device
SHINETSU CHEMICAL CO2 citations63
US6558812B2May 6, 2003
Liquid epoxy resin composition and semiconductor device
SHINETSU CHEMICAL CO2 citations63
US6534193B2Mar 18, 2003
Liquid epoxy resin composition and semiconductor device
SHINETSU CHEMICAL CO5 citations63
US6733902B2May 11, 2004
Liquid epoxy resin composition and semiconductor device
SHINETSU CHEMICAL CO6 citations62
US6780674B2Aug 24, 2004
Liquid epoxy resin composition and semiconductor device
SHINETSU CHEMICAL CO5 citations61
US12565608B2Mar 3, 2026
Thermally conductive resin composition
SHINETSU CHEMICAL CO0 citations58
US11984327B2May 14, 2024
Method for producing power module, and power module
SHINETSU CHEMICAL CO0 citations58
US11104099B2Aug 31, 2021
Thermally conductive resin sheet having light transmission and method for producing the same
SHINETSU CHEMICAL CO0 citations58
US10865304B2Dec 15, 2020
Heat-curable resin composition, heat-curable resin film and semiconductor device
SHINETSU CHEMICAL CO0 citations51
US10850482B2Dec 1, 2020
Resin composition, resin film, semiconductor laminate, method for manufacturing semiconductor laminate, and method for manufacturing semiconductor device
SHINETSU CHEMICAL CO0 citations51
US10829589B2Nov 10, 2020
Heat-curable resin composition
SHINETSU CHEMICAL CO0 citations51
US10730273B2Aug 4, 2020
Resin composition, resin film, semiconductor laminate, method for manufacturing semiconductor laminate, and method for manufacturing semiconductor device
SHINETSU CHEMICAL CO0 citations51
US7642661B2Jan 5, 2010
Liquid epoxy resin composition
SHINETSU CHEMICAL CO0 citations49
US10808102B2Oct 20, 2020
Thermosetting epoxy resin sheet for encapsulating semiconductor, semiconductor equipment, and method for manufacturing the same
SHINETSU CHEMICAL CO0 citations41
US10385203B2Aug 20, 2019
Heat-curable resin composition for semiconductor encapsulation
SHINETSU CHEMICAL CO0 citations41
US10407536B2Sep 10, 2019
Heat-curable resin composition for semiconductor encapsulation
SHINETSU CHEMICAL CO0 citations40
US9972507B2May 15, 2018
Method for encapsulating large-area semiconductor element-mounted base material
SHINETSU CHEMICAL CO0 citations40
US9711378B2Jul 18, 2017
Liquid epoxy resin composition for semiconductor sealing and resin-sealed semiconductor device
SHINETSU CHEMICAL CO0 citations40
US9382421B2Jul 5, 2016
Heat-curable resin composition
SHINETSU CHEMICAL CO0 citations40
SUMITA KAZUAKI
2 patentsUS8828806B2Sep 9, 2014
Dam composition for use with multilayer semiconductor package underfill material, and fabrication of multilayer semiconductor package using the same
SUMITA KAZUAKI8 citations81
US9018281B2Apr 28, 2015
Set of resin compositions for preparing system-in-package type semiconductor device
SUMITA KAZUAKI0 citations30